Applied Materials and A*STAR's Institute of Microelectronics to Drive Advanced 3D Chip Packaging with World-Class R&D Lab in Singapore
(Thomson Reuters ONE) -
* 3D chip packaging expected to be a major inflection point for the
semiconductor industry, allowing smaller packages, lower power consumption
and higher data bandwidth
* Joint R&D Centre is first dedicated facility of its kind focused on
developing next-generation packaging technologies to feed the explosive
growth of mobile devices
SINGAPORE, March 7, 2012 - Applied Materials, Inc., the global leader in
providing manufacturing solutions for the semiconductor, flat panel display and
solar photovoltaic industries, and the Institute of Microelectronics (IME), a
world-renowned research institute under the Agency for Science, Technology and
Research (A*STAR), officially opened the Centre of Excellence in Advanced
Packaging at Singapore's Science Park II today. Singapore's Minister for Trade
and Industry, Mr. Lim Hng Kiang, presided at today's opening ceremony.
The Centre of Excellence in Advanced Packaging has been built with a combined
investment of over USD$100 million from Applied Materials and IME. The world-
class facility features a 14,000 square foot Class-10 cleanroom and is equipped
with a fully-integrated line of 300 millimetre manufacturing systems to support
the research and development of 3D chip packaging, a critical growth area for
the semiconductor industry.
The Centre will be the most advanced lab of its kind dedicated to wafer level
packaging and will combine Applied Materials' leading-edge equipment and process
technology with IME's leading research capability in 3D chip packaging. The
Centre positions Singapore as a global leader in semiconductor R&D and is
expected to help accelerate the development and adoption of 3D packaging
technology globally.
Traditionally, chips are connected to packages using wires attached to only
their edges. This approach limits the possible number of connections from the
chip and the long wire connections result in signal speed delays and power
inefficiencies. With 3D chip packaging, multiple chips can be stacked on top of
each other and connected with wiring that runs vertically through the stack -
called through-silicon vias (TSVs). When used to stack memory chips on logic
chips, this technology is expected to reduce package size by 35%, decrease power
consumption by 50%, and increase data bandwidth by a factor of eight or more
times.
Conceived to support research collaboration between Applied Materials and IME,
the Centre will also allow both parties to pursue independent research
initiatives including process engineering, integration and hardware development.
For Applied Materials, this is a significant addition of new capabilities in
Singapore. The Centre also serves as a demonstration of how A*STAR is able to
develop and nurture a local ecosystem for advanced R&D through partnerships with
leading corporations. Research activities are already underway with a team of
over 50 personnel.
"Today, we are not only opening the most advanced wafer level packaging lab of
its kind in the world, but we are also opening a new product development
capability for Applied Materials in Asia," said Mike Splinter, Chairman and
Chief Executive Officer of Applied Materials. "This Centre will strengthen our
ability to advance new technologies and allow us to work more closely with our
customers in Asia."
On the collaboration with Applied Materials, Mr. Lim Chuan Poh, Chairman of
A*STAR, said, "The combined efforts of Applied Materials and A*STAR's Institute
of Microelectronics are a continuing testimony to A*STAR's spectrum of excellent
and industry-relevant scientific capabilities. It reaffirms our strategy of
leveraging a suite of capabilities to form meaningful and impactful public-
private research alliances which catalyse the growth of private sector R&D
activities in Singapore. This will create many high-value jobs locally and help
to further anchor Singapore's semiconductor manufacturing base."
Professor Dim-Lee Kwong, Executive Director of IME, added, "The Centre of
Excellence is a prime example of a strategic relationship fostered between two
leading players in the global semiconductor value chain and will spur the
development of innovative wafer-level packaging technologies to be implemented
globally. This collaboration will enable the semiconductor industry to
accelerate the adoption of 3D chip packaging."
================================================================
For Media Contact:
Applied Materials
Seraphina Seng (editorial/media)
Applied Materials South East Asia Pte Ltd
Tel: +65 63117531
Email:Seraphina_Seng(at)amat.com
Institute of Microelectronics
Cindy Chew
Industry Development
Tel: +65 6770 5375
Email:mailto:chewwfc(at)ime.a-star.edu.sg
About Applied Materials, Inc.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. At Applied Materials, we turn today's innovations into the industries of
tomorrow. Learn more atwww.appliedmaterials.com.
About Institute of Microelectronics (IME)
The Institute of Microelectronics (IME) is a research institute of the Science
and Engineering Research Council of the Agency for Science, Technology and
Research (A*STAR). Positioned to bridge the R&D between academia and industry,
IME's mission is to add value to Singapore's semiconductor industry by
developing strategic competencies, innovative technologies and intellectual
property; enabling enterprises to be technologically competitive; and
cultivating a technology talent pool to inject new knowledge to the industry.
Its key research areas are in integrated circuits design, advanced packaging,
bioelectronics and medical devices, MEMS, nanoelectronics, and photonics.
For more information about IME, please visit www.ime.a-star.edu.sg.
About Agency for Science, Technology and Research (A*STAR)
The Agency for Science, Technology and Research (A*STAR) is the lead agency for
fostering world-class scientific research and talent for a vibrant knowledge-
based and innovation-driven Singapore. A*STAR oversees 14 biomedical sciences
and physical sciences and engineering research institutes, and six consortia and
Centres, located in Biopolis and Fusionopolis as well as their immediate
vicinity.
A*STAR supports Singapore's key economic clusters by providing intellectual,
human and industrial capital to its partners in industry. It also supports
extramural research in the universities, hospitals, research centres, and with
other local and international partners.
For more information about A*STAR, please visit www.a-star.edu.sg.
R&D Laboratory at the Centre of Excellence in Advanced Packaging:
http://hugin.info/143724/R/1591814/500373.jpg
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Source: Applied Materials via Thomson Reuters ONE
[HUG#1591814]
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Datum: 07.03.2012 - 09:31 Uhr
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News-ID 122540
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