DGAP-News: Dialog Semiconductor Plc.: DIALOG SEMICONDUCTOR AND TSMC CREATE A PROCESS PLATFORM TO ADV

DGAP-News: Dialog Semiconductor Plc.: DIALOG SEMICONDUCTOR AND TSMC CREATE A PROCESS PLATFORM TO ADVANCE BCD POWER MANAGEMENT LEADERSHIP

ID: 129677

(firmenpresse) - DGAP-News: Dialog Semiconductor Plc. / Key word(s): Miscellaneous
Dialog Semiconductor Plc.: DIALOG SEMICONDUCTOR AND TSMC CREATE A
PROCESS PLATFORM TO ADVANCE BCD POWER MANAGEMENT LEADERSHIP

29.03.2012 / 02:00

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Company news

Reference: DIA0071

DIALOG SEMICONDUCTOR AND TSMC CREATE A PROCESS PLATFORM TO ADVANCE BCD
POWER MANAGEMENT LEADERSHIP

Industry's first 0.13-micron BCD tailored for portable devices,
delivering increased component density and enabling higher voltage
power management integration

Kirchheim/Teck, Germany and Hsinchu, Taiwan, R.O.C, 29 March 2012 - Dialog
Semiconductor plc (FWB: DLG), a provider of highly integrated innovative
power management, audio and short range wireless technologies, today
announced it is working closely with TSMC (TWSE: 2330, NYSE: TSM) to
develop its next generation of bipolar-CMOS-DMOS (BCD) technology
specifically tailored to high-performance power management ICs (PMICs) for
portable devices.

The BCD process can support the integration of advanced logic, analogue and
high-voltage features, including FET type transistors. It will also enable
Dialog to create even more highly integrated, smaller form factor single
chip devices optimised for portable products such as tablet PCs, ultrabooks
and smartphones. The transition to 0.13-micron greatly enhances a PMICs
power efficiency through a significant reduction of Rds(on), leading to
more energy efficient integrated circuit (IC) designs.

'Through close collaboration with TSMC we succeeded to increase our chip
shipments by a staggering 61 percent last year, while at the same time
accelerating the development of our next generation of PMICs through this
BCD process partnership,' said Dr. Jalal Bagherli, CEO of Dialog




Semiconductor. 'We will continue to work closely with TSMC to fuel our
leadership position as the analogue industry moves towards 300mm wafers.'

'Dialog is one of the technology leaders whose advanced integrated circuits
extend battery lifetime in portable devices, giving a great user
experience,' said Jason Chen, Senior Vice President of Worldwide Sales and
Marketing at TSMC. 'Working with companies such as Dialog enables TSMC to
consistently deliver cutting edge technology platforms for its customers.
We are pleased to support Dialog's future success using TSMC's 0.13-micron
technology.'

A broad range of proprietary Dialog IP blocks, based on the TSMC
0.13-micron BCD process, have already been developed for incorporation into
Dialog's next generation PMICs, and are currently being qualified with the
first devices expected to be available by the end of the year. The designs
will deliver the industry's leading power management performance for
portable devices.

Through the two companies' longstanding collaboration and development
partnership, Dialog is able to provide its customers with validated
low-power technologies that exceed their power management needs, meet
aggressive time-to-market goals and support production that ramps to their
high volume requirements.

+++ends

Dialog company contact:
Birgit Hummel, Dialog Semiconductor, Neue Strasse 95, D-73230
Kirchheim/Teck-Nabern, Germany

Tel: +49 7021 805 412 E-mail: birgit.hummel(at)diasemi.com
Fax: +49 7021 805 200 Web: www.dialog-semiconductor.com

Dialog media contact:
Rob Ashwell, Publitek Limited, 18 Brock Street, Bath, BA1 2LW, United
Kingdom

Tel: +44 1225 470 000 E-mail: rob.ashwell (at)publitek.com

TSMC company and media contact:
Elizabeth Sun, Director, Corporate Communication Division, TSMC

Tel: +886-3-5682085 E-mail: elizabeth_sun(at)tsmc.com

About Dialog
Dialog Semiconductor creates highly integrated, mixed-signal integrated
circuits (ICs) optimised for personal portable, low energy short-range
wireless, lighting, display and automotive applications. Dialog's power
management processor companion chips are essential for enhancing both the
performance in terms of extended battery lifetime and the consumers'
multimedia experience. With world-class manufacturing partners, Dialog
operates a fabless business model.

Dialog Semiconductor plc is headquartered near Stuttgart with a global
sales, R&D and marketing organisation. In 2011, it had approximately $527
million in revenue and was one of the fastest growing European public
semiconductor companies. It currently has approximately 650 employees. The
company is listed on the Frankfurt (FWB: DLG) stock exchange and is a
member of the German TecDax index.

About TSMC
TSMC is the world's largest dedicated semiconductor foundry, providing the
industry's leading process technology and the foundry's largest portfolio
of process-proven libraries, IPs, design tools and reference flows. The
Company's managed capacity in 2011 totaled 13.22 million (8-inch
equivalent) wafers, including capacity from Three advanced 12-inch
GIGAFAB(TM) facilities, four eight-inch fabs, one six-inch fab, as well as
TSMC's wholly owned subsidiaries, WaferTech and TSMC China, and its joint
venture fab, SSMC. TSMC is the first foundry to provide 28nm production
capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more
information about TSMC please visit http://www.tsmc.com.


End of Corporate News

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29.03.2012 Dissemination of a Corporate News, transmitted by DGAP - a
company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.

DGAP's Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
Media archive at www.dgap-medientreff.de and www.dgap.de

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Language: English
Company: Dialog Semiconductor Plc.
Tower Bridge House, St. Katharine's Way
E1W 1AA London
United Kingdom
Phone: +49 7021 805-412
Fax: +49 7021 805-200
E-mail: birgit.hummel(at)diasemi.com
Internet: www.diasemi.com
ISIN: GB0059822006
WKN: 927200
Indices: TecDAX
Listed: Regulierter Markt in Frankfurt (Prime Standard);
Freiverkehr in Berlin, Düsseldorf, Hamburg, München,
Stuttgart


End of News DGAP News-Service
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162766 29.03.2012


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Datum: 29.03.2012 - 02:00 Uhr
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