DGAP-News: ONFI Announces Publication of 3.0 Standard, Pushes Data Transfer Speeds to 400 MB/sec
ID: 367274
15.03.2011 15:00
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SANTA CLARA, Calif., 2011-03-15 15:00 CET (GLOBE NEWSWIRE) --The Open NAND Flash Interface (ONFI) Working Group, the organization dedicated
to simplifying integration of NAND Flash memory into consumer electronic
devices, computing platforms, and industrial systems, today published the new
ONFI 3.0 standard. By using the non-volatile DDR2 (NV-DDR2) interface, the
newly ratified standard reaches speeds of up to 400 megabytes (MB)/sec,
doubling the current NAND interface transfer rates.
The ONFI 3.0 standard details the interface and infrastructure that ONFI's more
than 100 members can employ to develop products that deliver the industry's
fastest NAND interface. Improvements in ONFI 3.0's NAND interface speeds will
also enable future NAND controllers to achieve similar performance with half
the number of channels, providing both a cost and space savings, which are key
requirements for solid-state drive (SSD) design. The ONFI 3.0 incorporates a
sophisticated die selection feature that reduces the number of chip enable (CE)
pins, which in turn lowers the number of controller pins making PCB routing
more efficient. Reducing the number of CE pins is especially important for
SSDs, providing a significant cost reduction and allowing the extra pins to be
assigned to other applications within the system.
'The enabling of fast ONFI 3.0 NAND is something a controller company can
greatly benefit from,' says K.S. Pua, Chairman and CEO of Phison Electronics.
'Our customers are eager to achieve higher speeds in their USB 3.0 and SATA SSD
products. The adoption of ONFI 3.0 would mean keeping up with the increasing
bandwidth offered by these host interfaces, bringing the overall performance of
NAND applications to an outstanding level.'
Like previous ONFI standards, ONFI 3.0 is designed with simplicity in mind for
NAND-based devices and is backwards compatible with previous ONFI standards. In
future versions, ONFI 3.0 will also support the ECC Zero (EZ-NAND?) interface,
which removes burden of the host controller having to keep pace with the fast
changing ECC requirements of NAND technology.
Simplifying Adoption with Broad Ecosystem Support
'Micron is focused on providing customers with a broad range of flash-based
storage options that deliver a clear performance value-add, whether it's at the
NAND component level or within our portfolio of system-level solutions,' said
Kevin Kilbuck, director of marketing for Micron's NAND Solutions Group. 'We
look forward to extending our NAND and SSD portfolio to take advantage of the
fast performance improvements and CE pin reduction that ONFI 3.0 provides.'
'The new ONFI 3.0 technology supporting interface transfer rates of up to
400MB/s is a key NAND capability to support future SSD design,' said Knut
Grimsrud, Intel fellow and director of storage architecture. 'With this
interface performance scaling, ONFI NAND will play an important role in SSD
compute development, especially for high-performance computing applications
where speed is paramount.'
'The ONFI 3.0 specification is a further step in the definition of a long term
roadmap for faster NAND Flash memory interfaces,' said Roberto Colecchia,
Marketing Manager at Spansion. 'Spansion has contributed to the design of this
specification which we believe will be able to support the growing demand for
faster data transfer required by several market segments.'
'ONFI 3.0 doubles the bus speed which is critical to delivering
high-performance solid state storage solutions across all compute application
needs, especially for given capacity footprints as NAND die density and page
sizes increase,' said Steffen Hellmold, vice president of business development
for SandForce. 'Furthermore the innovative measures taken to reduce pin count
will help drive system improvements in cost and complexity. We are proud
supporters of the ONFI specification and are working on delivering an SSD
processor solution fully embracing this new interface capability in 2012.'
About ONFI
The ONFI Working Group is dedicated to simplifying integration of NAND Flash
memory into consumer electronics (CE) applications and computing platforms.
Before the advancements made by the working group, use of NAND Flash in these
end-use applications was hampered by the lack of sufficient standardization. To
support a new NAND Flash component on a platform, host software and hardware
changes were often required. Implementing these changes was extremely costly
due to the new testing cycle required - which led to slower rates of adoption
for new NAND Flash components. ONFI aims to remedy that problem and speed time
to market for NAND Flash based applications.
The ONFI Working Group was formed in May 2006 and currently has more than 100
member companies. ONFI's founding companies include Hynix Semiconductor, Intel
Corporation, Micron Technology, Inc., Phison Electronics Corporation, SanDisk,
Sony Corporation, and Spansion.
Please visit www.ONFI.org to download the standard or for more information on
the initiative and how to become a contributor.
The ONFI logo is available at
http://www.globenewswire.com/newsroom/prs/?pkgid=6949
CONTACT: Deb Paquin for ONFi
Strategic Communications, Inc.
Tel: (916) 984-1921
Fax: (916) 984-1922
debpaquin@strategiccom.biz
News Source: NASDAQ OMX
15.03.2011 Dissemination of a Corporate News, transmitted by DGAP -
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The issuer is solely responsible for the content of this announcement.
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Language: English
Company: Micron Technology, Inc.
United States
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ISIN: US5951121038
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