Electronics & Semiconductors: Pressemitteilungen - Kategorie - Seite 27

Electronics & Semiconductors

Category / Electronics & Semiconductors


Octasic's New System-on-Chip DSPs are Optimized for Small Cells, Portable Base Stations and Specialized Handsets

Lincoln: OCT3032 low power SoCs provide the highest processing capacity per watt for small cell designs with 2G to 5G flexibility MONTREAL, Canada, 26 February, 2019 – Octasic, the leader in low power wir ...

Calculation concept shortens the design process of injection molded parts

Darmstadt, Germany: Using a new calculation process, it is now possible to predict fiber orientation-dependent component behavior in relation to shaped elements at an early stage and thus design the component in accordan ...

Leyou Technologies Enters into Shares Purchase Agreement with Meitu, Inc.

Hong Kong: Forges Strategic Alliance, Accelerates Penetration into Gaming Market HONG KONG, Feb 20, 2019 - (ACN Newswire) - Leyou Technologies Holdings Limited ("Leyou Technologies", and its subsidi ...

UltraSoC selects Redtree for expanding European market opportunity

Lincoln: Cambridge, UK – 19 February 2019 - UltraSoC, the leading provider of embedded analytics IP and software, today announced the appointment of Redtree Solutions as its technical sales representative in ...

More range for electric vehicles: functionalized thermoplastic sandwich components within minutes

Darmstadt, Germany: In times of impending bans for diesel and generally internal combustion engine (ICE) vehicles, battery electric vehicles (BEVs) are becoming increasingly interesting for buyers, especially in urban en ...

Port of Tanjung Pelepas Continues Digital Strategy Effort with Implementation of Latest Enterprise Resource Planning (ERP) System from Ramco Systems

Chennai, India: Chennai, India, Feb 13, 2019 - (ACN Newswire) - Pelabuhan Tanjung Pelepas Sdn Bhd (PTP), a member of MMC Group has sealed an agreement with Ramco Systems (Ramco) to upgrade the port's current Ent ...

Diamonds, Nanotubes and Onions made from Carbon

Berlin: LUM supports NanoCarbon Conference 2019 ...

ERICH JAEGER develops data connectors

: ERICH JAEGER presents the High-Speed Interface (HSI) data connector as a design study of a connector system for the data transmission between trailer and towing vehicle. ...

Suprema to introduce its latest range of biometric security and identification solutions at Intersec 2019

SEOUL, KOREA: SEOUL, KOREA, Jan 18, 2019 - (ACN Newswire) - Suprema is set to showcase its latest facial recognition technology, biometric-driven enterprise access control and industry leading-fingerprint identific ...

iDTRONIC’s HF Mid-Range Module M500 - Versatile: Compact integrated module with SMA antenna

Ludwigshafen: The HF Mid-Range M500 is a new integrated module and extends our proven embedded module series. The module is small and compact, with dimensions of only 10.95 × 6.0 × 1.7 cm. The integrated SMA a ...

OKI and ARC Innovation Center at Sheba Join Forces to Prevent Dementia

Jerusalem: Aiming at a service which prevents dementia and enables a society of healthy longevity Jerusalem, Jan 16, 2019 - (JCN Newswire) - OKI and ARC Innovation Center at Sheba (Sheba), the largest medical ...

Perforce Software at Embedded World 2019

Lincoln: • Now supporting embedded systems designers at every stage of the software lifecycle ...

Electronica 2018 in review by InnoSenT GmbH

Donnersdorf: The radar technology company looks back on their successful fifth year of participation in the fair. ...

Same warmth with half the bulk, HeiQ launches its first visible textile technology HeiQ XReflex

Zurich/Switzerland: Swiss textile innovator HeiQ launches HeiQ XReflex? a radiant barrier technology on high performance fabrics to create warmth without bulk and allow the user to ?Wear Less in Winter®? ...

Suprema to license BioSign under-display fingerprint algorithm to Qualcomm Technologies, Inc.

SEOUL, KOREA: SEOUL, KOREA, Jan 14, 2019 - (ACN Newswire) - Suprema, a global leader in biometrics and ID solutions, announced that the company has entered into a commercial software license and distribution agreem ...

BASF at BAU 2019 - Novel High-Performance Insulation Presented in First Carbon Concrete Composite Facade Elements

Lemförde: br /> SLENTEX®: Non-combustible and flexible insulation mat SLENTITE®: Slim and heavy-duty insulation panel BASF is presenting its high-performance insulation materials in a new application at th ...

Fire protection for buildings

Pfinztal: Development of "Smart Materials" for the construction sector ...

Insulating material based on foamed polymers

Pfinztal: Possibilities for the thermal insulation of building facades with foamed polymers ...

Manufacturing the next generation of aircraft seats: healthier, lighter, cost-effective and recyclable

Terrassa: HAIRMATE, a research and development project carried out by an international consortium, received a grant from the Horizon 2020 program of the European Union to manufacture and test the next generatio ...

QIAGEN acquires N-of-One, expanding its clinical bioinformatics capabilities in molecular oncology decision support

Redwood City, California / Hilden, Germany: Enhancing QIAGEN's industry-leading position with access to MarkerMine database and real-world evidence insights that provide insights for targeted therapy options ...


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