SUSS MicroTec and GenISys Announce Cooperation on Mask Aligner Lithography Simulation Software
(firmenpresse) - SÜSS MicroTec AG / Key word(s): Research/Technology/
SUSS MicroTec and GenISys Announce Cooperation on Mask Aligner
Lithography Simulation Software
DGAP-Media / 21.02.2012 / 10:01
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PRESS RELEASE
SUSS MicroTec and GenISys Announce Cooperation on Mask Aligner Lithography
Simulation Software
Garching, GERMANY, February 21, 2012 - SUSS MicroTec a leading supplier of
equipment and process solutions for the semiconductor industry and related
markets and GenISys GmbH, provider of high-performance software solutions
for nano scale fabrication, today announced a cooperation agreement to
combine the SUSS MicroTec mask aligner tools with the GenISys simulation
software Layout LABTM.
Within the cooperation GenISys Layout LABTM has been enhanced to accurately
model all available SUSS MicroTec mask aligner exposure optics. Both
parties join forces to market the SUSS MicroTec mask aligner technology
with the GenISys lithography simulation software Layout LABTM. The
combination of lithography equipment and matching simulation software is a
key success factor for cost effective process and device development for
the end user.
'The sophisticated and latest SUSS exposure optics technology, MO Exposure
Optics, enables the use of frontend technologies like illumination shaping
and mask layout optimization on mask aligner equipment', said Frank P.
Averdung, President and CEO of SUSS MicroTec AG. 'This in combination with
GenISys simulation software is a key technology enabler as it allows easy
modeling of large numbers of different source shapes.'
'Layout LABTM is a professional full 3D simulation platform for optical
proximity lithography, which enables to optimize mask layout and exposure
conditions by running a large number of simulations overnight. Besides
saving direct costs, users are gaining time to market' said Nezih Unal,
Vice President of GenISys.
About GenISys
Based in Munich, Germany, with offices in Tokyo, Japan, and Santa Clara,
Calif., GenISys GmbH develops, markets and supports flexible,
high-performance software solutions for the optimization of microstructure
fabrication processes. Addressing the market for e-beam direct-write and
optical lithography, GenISys combines deep technical expertise in layout
data processing, process modeling, correction and optimization with
high-caliber software engineering and a focus on ease of use. GenISys
products give researchers, IC and MEMS manufacturers and system suppliers
unparalleled efficiency, ease of use and optimal value in research,
development and production of new micro-patterning technologies. For more
information visit us at www.genisys-gmbh.com .
Contact:
Nezih Unal
unal(at)genisys-gmbh.com
+49 89 330919 760
About SUSS MicroTec
SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading
supplier of equipment and process solutions for microstructuring in the
semiconductor industry and related markets. In close cooperation with
research institutes and industry partners SUSS MicroTec contributes to the
advancement of next-generation technologies such as 3D Integration and
nanoimprint lithography as well as key processes for MEMS and LED
manufacturing. With a global infrastructure for applications and service
SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS
MicroTec is headquartered in Garching near Munich, Germany. For more
information, please visit http://www.suss.com.
Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke(at)suss.com
End of Media Release
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Language: English
Company: SÜSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: ir(at)suss.com
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Listed: Regulierter Markt in Frankfurt (Prime Standard);
Freiverkehr in Berlin, Düsseldorf, Hamburg, München,
Stuttgart
End of News DGAP-Media
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157486 21.02.2012
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Datum: 21.02.2012 - 10:01 Uhr
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