Tech Soft 3D Announces Third Annual Customer Meeting at COFES 2012
Event to Outline Product Roadmaps, Corporate Direction and Recent Innovations to Industry Executives
(firmenpresse) - BERKELEY, CA -- (Marketwire) -- 02/23/12 -- Tech Soft 3D, leading provider of component technology to the engineering software industry, today announced its third annual Customer Meeting will again be held at , The Congress on the Future of Engineering Software, on Thursday, April 12, in Scottsdale, Arizona. The Customer Meeting will feature roadmaps, highlights and demonstrations of the HOOPS Product Suite, as well as a discussion of the industry variables that guide these time-tested and innovative components.
"We aggregate the needs of hundreds of application developers, so our strategic planning is a good bellwether of where things may be headed in the industry at large," said Tech Soft 3D CEO, Ron Fritz. "We look forward to again welcoming customers, partners, press and potential customers to what has become a fun and informative annual event."
Those interested in attending the invitation-only COFES can contact Ron Fritz at to arrange an invitation. The event is slotted from 1-3 p.m. on Thursday, April 12 at the Scottsdale Plaza Resort, Las Palmas Room "A." For more itinerary details, visit the
COFES is a unique event that focuses on intense sessions of discussion, argument and debate on issues that will affect businesses that invest in and depend upon engineering technologies. The 13th annual COFES runs Thursday, April 12 through Sunday, April 15. See the website for additional information on the agenda, keynote speakers and registration.
Tech Soft 3D is the leading global provider of premier component technologies and related services that enable software developers to rapidly create world-class technical software. The company develops the HOOPS Product Suite, consisting of HOOPS Visualize, HOOPS Exchange and HOOPS Publish, SDKs for visualization, CAD data import/export and 3D PDF publishing. It also resells premium components such as Autodesk's RealDWG® Toolkit and AutoCAD® OEM platform and the Parasolid® Modeling Kernel from Siemens PLM Software. Tech Soft 3D software is used in nearly 450 applications worldwide. The company maintains corporate headquarters in Berkeley, California and can be reached through
Jackie Aaro
Phone: 541-385-6158
Themen in dieser Pressemitteilung:
Unternehmensinformation / Kurzprofil:
Datum: 23.02.2012 - 14:05 Uhr
Sprache: Deutsch
News-ID 117900
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contact information:
Town:
BERKELEY, CA
Kategorie:
Software
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