SUSS MicroTec launches RCD8: The new Resist Coat and Develop Platform

SUSS MicroTec launches RCD8: The new Resist Coat and Develop Platform

ID: 126146

(firmenpresse) - SÜSS MicroTec AG / Key word(s): Enterprise/
SUSS MicroTec launches RCD8: The new Resist Coat and Develop Platform

DGAP-Media / 19.03.2012 / 18:21

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PRESS RELEASE

SUSS MicroTec launches RCD8: The new Resist Coat and Develop Platform

Garching, GERMANY, March 19, 2012 - SUSS MicroTec, a leading supplier of
equipment and process solutions for the semiconductor and related markets,
launched the RCD8, a new manual Resist Coat and Develop Platform for
substrates. The new platform offers a high application variety coupled with
low investment costs as well as an easy transfer of processes from the RCD8
manual platform to a SUSS MicroTec production tool.

The RCD8 is the only tool in the market that offers the option to convert
from a spin coater with the patented GYRSET closed cover coating
technology to a spray developer within a few minutes. This coat and develop
platform can be custom tailored anywhere from e.g. a basic manual spin
coater to a semi-automated GYRSET enhanced coater and puddle&spray
developer tool, serving for daily R&D work up to small scale production.

In the past multiple dedicated tools of our Delta Series were used for
specific applications in MEMS, advanced packaging, LED or the R&D market.
The different types of tools are now brought together in the RCD8 platform,
which covers all necessary coating and developing processes for these
applications.

As an additional option the patented GYRSET rotating closed cover
coating technology can be integrated into the RCD8 spin coating module. For
various photoresists and applications, the GYRSET technology enables a
wider process window and reduces material consumption significantly.
Furthermore this technology allows even square substrates and pieces to be
coated all the way to the corners with a homogenous resist thickness.





'Whenever process changes are required over time, this versatile tool can
be field upgraded with various options to perfectly meet the actual needs
of our customers', says Frank P. Averdung, President and CEO of SUSS
MicroTec. 'With its large variety of available chucks and configurations,
literally all kind of substrate materials and shapes can be coated and
developed on the RCD8.'

About SUSS MicroTec
SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading
supplier of equipment and process solutions for microstructuring in the
semiconductor industry and related markets. In close cooperation with
research institutes and industry partners SUSS MicroTec contributes to the
advancement of next-generation technologies such as 3D Integration and Nano
Imprint Lithography as well as key processes for MEMS and LED
manufacturing. With a global infrastructure for applications and service
SUSS MicroTec supports more than 8,000 installed systems worldwide. SUSS
MicroTec is headquartered in Garching near Munich, Germany. For more
information, please visit http://www.suss.com.




Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke(at)suss.com


End of Media Release

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19.03.2012 Dissemination of a Press Release, transmitted by DGAP - a
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The issuer is solely responsible for the content of this announcement.

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Media archive at www.dgap-medientreff.de and www.dgap.de

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Language: English
Company: SÜSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: ir(at)suss.com
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Listed: Regulierter Markt in Frankfurt (Prime Standard);
Freiverkehr in Berlin, Düsseldorf, Hamburg, München,
Stuttgart


End of News DGAP-Media
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161259 19.03.2012


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Datum: 19.03.2012 - 18:21 Uhr
Sprache: Deutsch
News-ID 126146
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