DGAP-News: Press Release: Micron Technology, Inc.
(firmenpresse) - Micron Technology, Inc.
12.06.2012 14:00
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Micron Boosts DDR3 Offering With 2Gb and 4Gb, 1GHz/DDR3-2133, Delivering Power
Efficiency and Speed for High-Performance Networking and Graphics Segments
AMD and LSI Among the Latest Technology Partners
BOISE, Idaho, 2012-06-12 14:00 CEST (GLOBE NEWSWIRE) -- Micron Technology, Inc.
(Nasdaq:MU), one of the world's leading providers of advanced semiconductor
solutions, today introduced a new class of 1GHz, 2-gigabit (Gb) and 4Gb,
30-nanometer (nm) DDR3 devices, strengthening the company's comprehensive DDR3
portfolio. Designed for the high- performance networking and discrete graphics
markets, the new devices feature industry-leading low power use while
delivering speeds up to 2133 megatransfers per second (MT/s).
Micron supports its customers in highly competitive market segments with a
broad portfolio of DRAM and nonvolatile memory devices that meet the demand for
high-performance, cost-efficient memory solutions. 'Micron has been successful
in creating a complete DRAM portfolio, and this product offering rounds out the
broadest DRAM offering in the industry,' said Mike Howard, senior principal
analyst, DRAM and Memory at iSuppli.
Optimized for the demanding, performance-driven discrete graphics and
high-speed networking markets, the new DDR3 devices provide the latest
SoCs/GPUs with ever-increasing bandwidth required for this space.
Industry-leading suppliers AMD and LSI are among the latest technology and IP
partners for these products, both having worked closely with Micron throughout
the development process. Micron relies on its ecosystem partnerships to deliver
greater product reliability and compatibility, which, in turn, optimizes
customers' time to market and design costs.
'Massive data growth continues to tax storage and networking equipment, and
contending with that growth requires high-performance memory interfaces to meet
system bandwidth requirements,' said Harold Gomard, SerDes and DDR IP Product
Manager, LSI. 'Micron's broad memory product line and support for 1GHz DDR3
memory in 2 and 4Gb-based modules enables LSI to meet the needs of enterprise
and cloud networking and storage customers.'
'We continue to build an aggressive portfolio for the performance-focused
graphics market,' said Matt Skynner, corporate vice president and general
manager, AMD Graphics. 'With Micron's new DDR3 devices we expect to drive even
more performance.'
In addition to components that satisfy both the discrete graphics and
networking segments, Micron will offer 2133 megatransfers per second (MT/s)
module form factors, including networking-specific ECC UDIMMs.
'High-speed DDR3 will be powering the mainstream graphics and high-performance
networking markets in 2012 and beyond. Micron is prepared to support these
demanding markets by leveraging our expertise with high-volume, cost-efficient
DDR3 products and developing these very high-performance DDR3 devices,' said
Robert Feurle, vice president of DRAM marketing for Micron. 'The combination of
our advanced process technology and our commitment to the graphics and high-end
computing markets has proven highly successful, and these new 30nm 2Gb and 4Gb
DDR3 products will continue to deliver on that promise.'
Samples of Micron's new class of high-performance, low-power DDR3 devices are
available now, with volume production ramping by summer. For more information,
please visit www.micron.com.
Micron Technology, Inc., is one of the world's leading providers of advanced
semiconductor solutions. Through its worldwide operations, Micron manufactures
and markets a full range of SSDs, DRAM, NAND and NOR flash memory, as well as
other innovative memory technologies, packaging solutions and semiconductor
systems for use in leading-edge computing, consumer, networking, embedded and
mobile products. Micron's common stock is traded on the NASDAQ under the MU
symbol. To learn more about Micron Technology, Inc., visit www.micron.com.
The Micron Technology, Inc. logo is available at
http://www.globenewswire.com/newsroom/prs/?pkgid=6950
(c)2012 Micron Technology, Inc. All rights reserved. Information is subject to
change without notice. Micron and the Micron orbit logo are trademarks of
Micron Technology, Inc. This news release contains forward-looking statements
regarding the production of DDR3. Actual events or results may differ
materially from those contained in the forward-looking statements. Please refer
to the documents Micron files on a consolidated basis from time to time with
the Securities and Exchange Commission, specifically Micron's most recent Form
10-K and Form 10-Q. These documents contain and identify important factors that
could cause the actual results for Micron on a consolidated basis to differ
materially from those contained in our forward-looking statements (see Certain
Factors). Although we believe that the expectations reflected in the
forward-looking statements are reasonable, we cannot guarantee future results,
levels of activity, performance or achievements.
CONTACT: Mary Ellen Ynes
maryellen.ynes(at)zenogroup.com
650-801-7954
News Source: NASDAQ OMX
12.06.2012 Dissemination of a Corporate News, transmitted by DGAP -
a company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.
DGAP's Distribution Services include Regulatory Announcements,
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Media archive at www.dgap-medientreff.de and www.dgap.de
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Language: English
Company: Micron Technology, Inc.
United States
Phone:
Fax:
E-mail:
Internet:
ISIN: US5951121038
WKN:
End of Announcement DGAP News-Service
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