Applied Materials Solves Critical Interconnect Challenge with Breakthrough Flowable Copper Technology
(Thomson Reuters ONE) -
* Revolutionary method of depositing the vital wiring seed layer has no
foreseeable node limit
* Tool of record at leading chipmakers; more than 30 chambers shipped
* New system introduced in live webcast from Semicon West today at 8:00am PDT
SANTA CLARA, Calif., July 10, 2012 - Applied Materials, Inc. today pushed the
boundaries of interconnect technology, the pathways that connect the billions of
transistors on a chip, with the announcement of its Applied Endura(®) Amber(TM
)PVD system. Featuring revolutionary copper reflow technology, the Amber system
is the only single-chamber solution proven to enable void-free copper structures
at the 1Xnm node - a critical challenge in the manufacturing of advanced logic
and memory devices.
"The Applied Endura Amber system delivers a breakthrough solution for scaling
interconnects beyond the 20nm node while maintaining good production yields,"
said Sundar Ramamurthy, vice president and general manager of Applied's Metal
Deposition Products business unit. "Applied has extended its leading PVD
technology with a unique system that achieves rapid, void-free fill of these
structures at virtually any device node. We're seeing strong customer momentum
for the Amber system with more than 30 chambers already in the field. Systems
are already qualified as tool of record at leading logic and memory device
manufacturers."
Today's high-density microchips feature complex, multilevel networks with more
than 60 miles of copper wiring and as many as 10 billion vertical connections,
or vias, between layers. Moving forward, these numbers will significantly
increase, with interconnect structures becoming much narrower and deeper, making
it extremely difficult for conventional technologies to completely and reliably
fill the structure with copper. At the 1Xnm node, this is a major concern, since
a single void can render the chip useless.
Applied's Amber copper reflow technology solves this critical challenge by
turning the small size of these features from a problem to an advantage. Using
capillary action, the deposited copper is drawn into even the smallest features,
filling from the bottom upwards to enable rapid, void-free fill from the
smallest to the largest features on any die layout.
The Amber system is built on the innovations pioneered with the highly-
successful Applied Endura CuBS RFX PVD system. The CuBS RFX system's unique
selective PVD technology provides the precise deposition profile - thicker at
the bottom and no copper overhang - that is essential for the subsequent reflow
process.
The exciting Applied Endura Amber PVD system is one of several important new
products to be highlighted by Applied Materials at SEMICON West 2012 from July
10-12. More information can be found at Applied's online booth at
www.becauseinnovationmatters.com, which will be updated regularly throughout the
show.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. At Applied Materials, we turn today's innovations into the industries of
tomorrow. Learn more at www.appliedmaterials.com.
# # #
Contact:
Connie Duncan (editorial/media) 408.563.6209
Michael Sullivan (financial community) 408.986.7977
Photo: The Revolutionary Applied Endura Amber PVD System:
http://hugin.info/143724/R/1625431/519915.jpg
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Source: Applied Materials via Thomson Reuters ONE
[HUG#1625431]
Unternehmensinformation / Kurzprofil:
Datum: 10.07.2012 - 13:31 Uhr
Sprache: Deutsch
News-ID 163869
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contact information:
Town:
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"Applied Materials Solves Critical Interconnect Challenge with Breakthrough Flowable Copper Technology"
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