ASM International Books Repeat Orders for Plasma Enhanced ALD Systems, Broadening its ALD Portfolio with New Applications
(Thomson Reuters ONE) -
ALMERE, The Netherlands, April 28, 2010 -ASM International N.V. (www.asm.com)
(NASDAQ: ASMI and Euronext Amsterdam: ASM) today announced that it has received
multiple repeat orders this year for its plasma enhanced atomic layer deposition
(PEALD) systems from a leading memory customer in Asia for volume manufacturing
at multiple fab lines. All systems will be used for dielectrics in double
patterning applications for advanced lithography at the 3X technology node and
below.
Additionally, ASM is expanding developments for PEALD dielectrics for logic
transistor gate protection applications at the 22 nm node. As part of this
development program, PEALD tools have been delivered to multiple advanced logic
customers.
"PEALD is increasingly being adopted due to its ability to control deposition
one atomic layer at a time on a wide range of device structures," said Tominori
Yoshida, General Manager of ASM's Plasma Products product group. "We have made
very good progress in developing PEALD as an enabling technology for new
dielectrics applications. Our patent position in PEALD should enable us to
fully benefit from the broad range of new applications in the challenging 2X and
1X nodes."
The PEALD reactors are optimized to deposit dielectrics including SiO, SiN and
SiCN. A major advantage of ASM's PEALD process is its ability to deliver
conformal thin films at low temperatures, which is especially beneficial for
double patterning lithography technologies where thin dielectrics are deposited
over temperature sensitive photoresists for critical dimension control and pitch
reduction.
Each of the systems ordered includes multiple PEALD reactors implemented on
ASM's Eagle(®) XP platform, the company's production-proven standard platform
that can be configured with plasma enhanced chemical vapor deposition (PECVD),
Thermal ALD or PEALD reactors.
About ASM International
ASM International N.V., headquartered in Almere, the Netherlands, and its
subsidiaries design and manufacture equipment and materials used to produce
semiconductor devices. ASM International and its subsidiaries provide production
solutions for wafer processing (Front-end segment) as well as assembly and
packaging (Back-end segment) through facilities in the United States, Europe,
Japan and Asia. ASM International's common stock trades on NASDAQ (symbol ASMI)
and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information,
visit ASMI's website at www.asm.com
# # #
Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of
1995: All matters discussed in this statement, except for any historical data,
are forward-looking statements. Forward-looking statements involve risks and
uncertainties that could cause actual results to differ materially from those in
the forward-looking statements. These include, but are not limited to, economic
conditions and trends in the semiconductor industry generally and the timing of
the industry cycles specifically, currency fluctuations, the timing of
significant orders, market acceptance of new products, competitive factors,
litigation involving intellectual property, shareholder and other issues,
commercial and economic disruption due to natural disasters, terrorist activity,
armed conflict or political instability, epidemics and other risks indicated in
the Company's filings from time to time with the U.S. Securities and Exchange
Commission, including, but not limited to, the Company's reports on Form 20-F
and Form 6-K. The Company assumes no obligation nor intends to update or revise
any forward-looking statements to reflect future developments or circumstances.
Contacts:
Erik Kamerbeek
+31 881008500
Mary Jo Dieckhaus
+1 212-986-2900
[HUG#1409675]
ASM is broadening its ALD portfolio with new applications: http://hugin.info/132090/R/1409675/362201.pdf
Unternehmensinformation / Kurzprofil:
Datum: 28.04.2010 - 23:58 Uhr
Sprache: Deutsch
News-ID 19896
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