Fully-automated Solder Removal

A newly developed positioning table motorization for FINEPLACER® matrix largely enhances the machine's capabilities with regard to automatic solder removal and dispensing processes.

(firmenpresse) - Within a 50 mm range in x and y direction the motorization allows for a high-precision and 100% reproducible table movement. This new feature is a key factor of success in a wide spectrum of application when a controlled and user-independent position shifting of the substrate is required.

Other than soldering and de-soldering, this includes contactless solder removal of BGA with dimensions up to 50 x 50 mm, dispensing of solder paste, flux or adhesives as well as various special applications, such as underfill fillet cutting prior to underfill rework processes.

All movement paths can be created directly in the IPM Hybrid operating software in a convenient, fast and intuitive way. The user can choose from an extensive selection of patterns, such as vertical, horizontal and diagonal lines, circles and polygons as well as complex spiral and meander structures. Various reference points are available.

Another benefit results from the integrated theta rotation which helps compensating angular errors if the PCB or substrate has not been clamped in correctly.

Introducing automated processes to the rework cycle allows for multi-system-handling by just one operator and helps improving throughput, productivity and reliability – an improvement greatly appreciated by customers from the automotive industry, medical engineering and aviation, among others.

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Bereitgestellt von Benutzer: Finetech
Datum: 30.01.2013 - 15:12 Uhr
Sprache: Deutsch
News-ID 224422
Anzahl Zeichen: 1604

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Kategorie:

Electronic Components

Typ of Press Release: Produktinformation
type of sending: Veröffentlichung
Date of sending: 30.01.2013

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"Fully-automated Solder Removal"
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