STMicroelectronics Signs Comprehensive Agreement with Rambus
(Thomson Reuters ONE) -
Agreement covers FD-SOI design, security, and memory and interface technologies
and settles all outstanding claims
Geneva, June 17, 2013 - STMicroelectronics (NYSE: STM), a global semiconductor
leader serving customers across the spectrum of electronics applications, today
announced that it has signed a comprehensive agreement with Rambus Inc.
(NASDAQ:RMBS) that expands existing licenses between the two Companies, settles
all outstanding claims, and commits both organizations to explore additional
opportunities for collaboration.
The multifaceted agreement gives Rambus access to ST's Fully-Depleted Silicon On
Insulator (FD-SOI) process-technology design environment. With this, Rambus will
be able to benefit from FD-SOI's reduced silicon geometries and lower power
consumption at 28nm and below in its future memory and interface solutions.
For its part, ST has secured license terms from the Cryptography Research, Inc.
(CRI) division of Rambus to make it possible for ST to deploy Differential Power
Analysis (DPA) countermeasures and CryptoFirewall(TM) core security technology
across a wider range of products. DPA is a form of attack that involves
monitoring the fluctuating electrical power consumption of a target device and
then using statistical methods to derive cryptographic keys and other secrets.
DPA countermeasures are used to protect secret cryptographic keys, including
those used to secure transactions for banking, identity, pay television, video
gaming, smartphones, government, and other applications.
CryptoFirewall cores are complete hardware-based security blocks designed by CRI
to protect against a wide range of attacks and tampering techniques.
The new terms allow ST to further strengthen the security robustness of its
leading-edge set-top box ICs and gateways for multimedia services including
PayTV.
"This agreement with Rambus is an exceptional win-win-win for both parties, as
they can now share and use more broadly important technologies that have great
value to us, the industry and our customers," said Gian Luca Bertino, Executive
Vice President Digital Convergence Group, STMicroelectronics. "While Rambus can
now use our revolutionary FD-SOI process technology in its designs, ST intends
to further enhance the security of our outstanding set-top box ICs and to deploy
DPA countermeasures across the whole range of our relevant product portfolio."
"ST has implemented DPA countermeasure technology for years in its secure
microcontrollers and has been a leader in data security", said Paul Kocher,
President and Chief Scientist at the Cryptography Research division of Rambus.
"With this new comprehensive and mutually beneficial agreement, our technology
will be further deployed across a wide array of products and applications,
benefitting customers by improving the security of digital systems."
In settling all outstanding claims, the agreement also covers ST's use of
Rambus' patented memory interface and serial-link innovations.
About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and office,
at work and at play, ST is found everywhere microelectronics make a positive and
innovative contribution to people's life. By getting more from technology to get
more from life, ST stands for life.augmented.
In 2012, the Company's net revenues were $8.49 billion. Further information on
ST can be found at www.st.com.
For further information, please contact:
INVESTOR RELATIONS:
Tait Sorensen
Group VP, Investor Relations
Tel: +1 602 485 2064
tait.sorensen(at)st.com
MEDIA RELATIONS:
Nelly Dimey
Director, Corporate Media and Public Relations
Tel: +33 1 58 07 77 85
nelly.dimey(at)st.com
ST RAMBUS:
http://hugin.info/152740/R/1710078/566890.pdf
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originality of the information contained therein.
Source: STMicroelectronics via Thomson Reuters ONE
[HUG#1710078]
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Bereitgestellt von Benutzer: hugin
Datum: 17.06.2013 - 22:31 Uhr
Sprache: Deutsch
News-ID 270514
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Town:
Geneva
Kategorie:
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