EVENT ADVISORY: Semiconductor Industry Leaders to Examine the Future of 3D NAND at December 10 Event
(Thomson Reuters ONE) -
SANTA CLARA, Calif., December 2, 2013- Manufacturing 3D NAND designs requires
overcoming formidable technical challenges to create extremely complex high-
aspect-ratio structures. The resulting reliability, density, performance, and
power savings benefits will continue to drive this vertical NAND transition. On
December 10, 2013, Applied Materials, Inc. will host an important forum in
Washington D.C. for a thought-provoking examination of the growing momentum in
3D NAND from device, system, and user perspectives.
3D NAND is clearly here to stay with leading-edge memory chipmakers focusing
significant resources on this segment. But while 3D NAND promises substantial
benefits in easing key planar scaling limitations, several questions remain
regarding the future of this technology. How far can it be scaled? What issues
will affect its scaling? Which applications will use it first? Will 3D NAND
continue lowering the cost per bit? What technologies will follow?
Applied Materials and guest panelists from several industry leaders will provide
insight on these critical issues in a panel titled "3D NAND Is a Reality -
What's Next?" To register for this event, please visit
http://www.appliedmaterials.com/NAND-panel.
Moderator: Gill Lee, senior director, principal member of technical staff,
Silicon Systems Group, Applied Materials
Panel:
* Ritu Shrivastava, Ph.D. - vice president, technology development,
SanDisk Corporation
* Chuck Dennison - senior director, process integration, Micron
Technology, Inc.
* Seok-Kiu Lee - vice president, head
of flash device technology group, R&D division, SK hynix Inc.
* Hang-Ting Lue, Ph.D. - deputy director, Nanotechnology R&D division,
Macronix International Co., Ltd.
* Bradley Howard, Ph.D. - vice president, advanced technology group,
Etch, Applied Materials, Inc.
Where: Omni Shoreham Hotel,2500 Calvert Street NW, Washington, D.C.
When: Tuesday, December 10, 2013
Schedule:
* 5:00 - 6:00pm Shuttle from Hilton Washington Hotel
* 5:00 - 6:15pm Registration and Reception
* 6:15 - 7:30pm Panel Discussion
* 7:30pm Return shuttle to Hilton Washington Hotel
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. Learn more at www.appliedmaterials.com.
# # #
Contact:
Connie Duncan (editorial/media) 408.332.0541
Michael Sullivan (financial community) 408.986.7977
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Source: Applied Materials via GlobeNewswire
[HUG#1746275]
Unternehmensinformation / Kurzprofil:
Datum: 02.12.2013 - 14:00 Uhr
Sprache: Deutsch
News-ID 321739
Anzahl Zeichen: 3809
contact information:
Town:
Santa Clara
Kategorie:
Business News
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