STMicroelectronics Reveals Advanced MEMS Accelerometers Engineered to Withstand Stresses of Modern Mobile Life
(Thomson Reuters ONE) -
Innovative design boosts the sensor's thermal and mechanical stability to
deliver robust high performance in ultra space-saving footprint
Geneva, December 3, 2013 - STMicroelectronics (NYSE: STM), a global
semiconductor leader serving customers across the spectrum of electronics
applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems)
devices for consumer and mobile applications[1], has unveiled its new state-of-
the-art high-performance MEMS accelerometer engineered to withstand increasingly
challenging conditions inside the latest smartphones and other portable devices.
With today's processing-intensive mobile apps and super-slim handset designs,
portable electronics are more vulnerable to thermal variation and bending. As
OEMs push to deliver new models supporting ever more precise, stable and
responsive movement sensing for features such as inclinometer, gesture
recognition, gaming, artificial horizon in cameras, indoor navigation, and
augmented reality, ST's new LIS2HH12 3-axis accelerometer introduces an
innovative mechanical structure and dedicated processing to deliver consistent
and stable high performance in thermally challenging conditions inside ever-
slimmer portable applications.
"The innovative architecture of our new accelerometer represents a significant
advance in the design of MEMS devices," said Benedetto Vigna, Executive Vice
President, General Manager, Analog, MEMS & Sensors Group, STMicroelectronics.
"This next-generation device addresses the need of the mobile industry for
higher performance and stability in advanced motion-sensitive applications."
The LIS2HH12 is housed in an ultra-small 2mm x 2mm x 1mm package, giving
designers extra flexibility to meet pc-board layout rules for wireless handsets,
and helping achieve a low overall handset profile. The accelerometer has
selectable full-scale range of ±2, ±4 or ±8 g and a 16-bit digital output, an
integrated temperature sensor, industry-standard I2C and SPI interfaces, a wide
analog supply-voltage range of 1.71V to 3.6V, and two programmable interrupt
generators that help streamline system design. With typical Zero-g level change
versus temperature of ±0.25mg/C, the stability of the LIS2HH12 has improved
twice compared with the previously announced devices. Also, the rejection versus
bending with a typical offset accuracy of ±30mg has improved by 25% over the
existing solutions.
In addition, the LIS2HH12 is board- and software-compatible with ST's recently
announced LSM303C 2mm x 2mm MEMS eCompass module, enabling OEMs to create
differentiated handset products economically by leveraging common hardware and
software. Alternatively, the LIS2HH12 accelerometer can be used with ST's
LIS3MDL standalone magnetic sensor to create an eCompass using discrete
components.
Engineering samples of the LIS2HH12, in the 2mm x 2mm x 1mm LGA-12 package, are
available now. Volume production is expected to start in Q1 2014, with unit
pricing at $0.90 for quantities of 1,000 pieces.
About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and office,
at work and at play, ST is found everywhere microelectronics make a positive and
innovative contribution to people's life. By getting more from technology to get
more from life, ST stands for life.augmented.
In 2012, the Company's net revenues were $8.49 billion. Further information on
ST can be found at www.st.com.
For further information please contact:
Michael Markowitz
Director Technical Media Relations
STMicroelectronics
Tel: +1 781 591 0354
michael.markowitz(at)st.com
--------------------------------------------------------------------------------
[1] IHS: Consumer and Mobile MEMS Market Tracker H1 2013
High-Perf Accelerometer from ST_IMAGE:
http://hugin.info/152740/R/1747287/588296.jpg
High-Perf Accelerometer from ST:
http://hugin.info/152740/R/1747287/588295.pdf
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Source: STMicroelectronics via GlobeNewswire
[HUG#1747287]
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Datum: 03.12.2013 - 15:00 Uhr
Sprache: Deutsch
News-ID 322268
Anzahl Zeichen: 5230
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Town:
Geneva
Kategorie:
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