Applied Materials Develops Advanced Patterning Solution for Memory Devices
(Thomson Reuters ONE) -
* Unique Saphira(TM) APF(TM) CVD hardmask process enables advanced memory
devices
* OMNIS(TM) Asher system from PSK removes Saphira APF hardmask while
preserving high aspect ratio features
* The combined systems provide an efficient, readily integrated, comprehensive
solution
SANTA CLARA, Calif., Nov. 10, 2014 - Applied Materials, Inc. today announced it
collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based
leader in photoresist removal, to develop an advanced patterning solution for
the manufacture of future generations of NAND and DRAM device designs. The new
solution, available now, consists of the unique Saphira(TM) APF* hardmask
deposited on the industry-leading Applied Producer(® )XP Precision(TM) CVD*
system, and the Saphira removal process supported on the PSK OMNIS(TM) Asher
tool. This comprehensive solution represents a breakthrough in precision
materials engineering for complex patterning applications.
"This collaboration allows us to demonstrate and enhance the Saphira film's
deposition qualities and removal process," said Dr. Mukund Srinivasan, vice
president and general manager of the Dielectric Systems and Modules Group at
Applied Materials. "A new superior class of hardmask films, such as the Saphira
APF, is needed as the extendibility of traditional films to support high aspect
ratio patterning is a major barrier to NAND and DRAM scaling. Teaming with
industry experts on this new hardmask solution gives Applied a strong advantage
to set the pace for advanced memory manufacturing."
"We are very pleased to work with Applied Materials on developing a highly
productive, enabling technology that helps solve tomorrow's patterning
challenges," said JJ Lee, SVP and chief marketing officer of PSK. "With the
unprecedented complexities in patterning future device designs, we believe it is
through cooperative efforts that the industry can achieve novel solutions to
meet customer requirements. The combination of systems from Applied and PSK
provide the industry with an efficient, readily integrated, comprehensive
solution."
The Saphira APF deposition and PSK OMNIS Asher systems resolve major issues to
improve patterning of more complex device structures at advanced technology
nodes. For emerging high aspect ratio and dense patterning requirements, the
Saphira APF process introduces new film properties that include greater
selectivity and transparency. The high-productivity PSK OMNIS Asher system is
capable of completely removing the Saphira hardmask layer while preserving the
patterned shapes and underlying materials. Together, these leading-edge
processes have demonstrated the capabilities to meet the patterning demands of
next-generation devices.
Applied has exclusively licensed its proprietary removal process for the Saphira
APF hardmask to PSK.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in precision
materials engineering solutions for the semiconductor, flat panel display and
solar photovoltaic industries. Our technologies help make innovations like
smartphones, flat screen TVs and solar panels more affordable and accessible to
consumers and businesses around the world. Learn more at
www.appliedmaterials.com.
*APF = advanced patterning film; CVD = chemical vapor deposition
Applied Materials, the Applied Materials logo, and product names so designated
are trademarks of Applied Materials, Inc. and/or its affiliates in the U.S. and
other countries. Third party trademarks mentioned are the property of their
respective owners.
###
Contact:
Connie Duncan (editorial/media) 408.563.6209
Michael Sullivan (financial community) 408.986.7977
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Source: Applied Materials via GlobeNewswire
[HUG#1869992]
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Datum: 10.11.2014 - 13:30 Uhr
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News-ID 351110
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