Round Solutions’ wireless ‘PingPong’ IoT edge node platform connects field devices to the cloud
(firmenpresse) - Neu-Isenburg, 19th May, 2015 - Round Solutions, a leading engineering and service specialist for IoT technologies, has launched its wireless PingPong IoT edge node, a flexible and powerful hardware platform for connecting field devices to the cloud.
The RTOS supporting small form factor board with powerful Microchip PIC32MZ 32-bit MCU and a high-speed cellular Telit module is based on a modular hardware design principle that simplifies the integration of custom-specific applications and communication standards into a single solution platform. Target applications range from cloud-connected oil tanks and intelligent waste bins up to cloud-connected gateway systems for manufacturing robots.
“Our PingPong platform offers software engineers an application-ready, pre-validated PingPong data exchange mechanism which eases the IoT integration of any field device,” explains Ben Hoelke, CEO of Round Solutions. “With the supplied Round Solutions Open Source PingPong Software Development Kits the platform can be configured for nearly all IoT/M2M applications, such as sensor reading, asset tracking, routers, measurement technology, telemetry and security control. Thus, Round Solutions’ PingPong offers companies wanting to transfer their data to IoT cloud-servers a complete solution including software libraries and source code.”
The PingPong hardware platform offers high-speed cellular modules for the IoT connectivity as well as numerous interfaces to the field – which can also be controlled via the cloud. The standard interfaces include, for example, Ethernet, USB and CAN as well as a high-precision GNSS (Global Navigation Satellite System). Developers can add various expansion cards to create a nearly unlimited number of application scenarios. Application-ready expansion cards are available for WLAN, Bluetooth, I/0, Iridium satellite communications, ISM/RF, SigFox, NFC/RFID and camera connectivity. All functions are ready for use as soon as the expansion cards are attached to the motherboard.
PingPong „Sending and Receiving Beyond Believing"
Unternehmensinformation / Kurzprofil:
Round Solutions GmbH & Co. KG develops hardware and services for Internet of Things (IoT) and offers component solutions for wireless machine-to-machine (M2M) communication. The company’s modules, antennas and design-in services improve the value creation processes for customers of all sizes and industries. Round Solutions creates the necessary technological preconditions for developing new IoT-based business models - such as for applications within Industry 4.0.
Round Solutions offers hardware and services from a single source: finished hardware, such as the modular expandable platform PingPong, services with SIM cards and Cloud databases as a wireless loT Quick Start kit, which software developers can easily use for their own applications to connect and steer business processes over the internet. The product range also includes high-performance antennas (quad-band, penta-band, external and embedded). Moreover, Round Solutions advises companies on all aspects relevant to development, automation and remote control of M2M interfaces and complete IoT processes, such as choosing hardware and hardware connection or service concepts and remote access concepts. For all application scenarios, Round Solutions has specialised in the use of wireless technologies, such as LTE, UMTS, GPS, Glonass, Bluetooth, RFID, ZigBee, WIFI, SigFox and ISM. www.roundsolutions.de
Round Solutions GmbH & Co. KG
Elke Kleinhans
Hans-Böckler-Str. 16
D-63263 Neu-Isenburg
Tel. +49 (0) 6102 799 28 0
info(at)roundsolutions.com
www.roundsolutions.com
SAMS Network
Michael Hennen
Zechenstrasse 29
D-52146 Würselen, Germany
Tel.: +49 (0) 2405 – 452 6720
michael.hennen(at)sams-network.com
www.sams-network.com
Datum: 19.05.2015 - 12:52 Uhr
Sprache: Deutsch
News-ID 394180
Anzahl Zeichen: 2134
contact information:
Kategorie:
Networking
Typ of Press Release: Produktankündigung
type of sending: Veröffentlichung
Date of sending: 19.05.2015
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