Applied Materials' New Etch System Provides Atomic-Level Precision
(Thomson Reuters ONE) -
* New Centris(TM) Sym3(TM) Etch system's innovative chamber architecture
enables precision removal of materials to the atomic level
* Already installed as a production tool of record with multiple customers,
the new system is experiencing the fastest adoption rate for etch in
Applied's history
SANTA CLARA, Calif., July 13, 2015 - Applied Materials, Inc. today announced a
next-generation etch tool, the Applied Centris(TM) Sym3(TM) Etch system,
featuring an entirely new chamber for atomic-level precision manufacturing. To
overcome within-chip feature variations, the Centris Sym3 system leapfrogs
current tools to provide chipmakers with the control and precision needed to
pattern and create densely packed 3D structures in advanced memory and logic
chips.
"Drawing on over 20 years of etch learning and our expertise in precision
materials removal, the Sym3 system represents a brand new design, built from the
ground up, that solves persistent and impending industry challenges," said Dr.
Raman Achutharaman, vice president and general manager of Applied's Etch
business unit. "Customer traction has been remarkable, resulting in the fastest
adoption rate we've seen for an etch tool in the company's history, with record
ramp to production at leading-edge fabs."
The Centris Sym3 etch chamber employs Applied's unique True Symmetry(TM)
technology with multiple tuning controls for optimizing global process
uniformity to the atomic level. Key to the design is a focus on controlling and
removing etch byproducts, which are increasingly hampering within-chip
patterning uniformity. The system mitigates byproduct re-deposition to overcome
the challenges of line edge roughness, pattern loading and defects - issues that
are becoming more limiting for each successive technology node. Combined with an
advanced RF technology that controls ion energy and angular distributions, the
Sym3 system delivers unsurpassed vertical profiles for high aspect ratio 3D
structures.
The Centris Sym3 platform's six etch and two plasma clean process chambers
feature system intelligence software to ensure that every process in every
chamber matches precisely, enabling repeatability and high productivity for
high-volume manufacturing.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in materials
engineering solutions for the semiconductor, flat panel display and solar
photovoltaic industries. Our technologies help make innovations like
smartphones, flat screen TVs and solar panels more affordable and accessible to
consumers and businesses around the world. Learn more at
www.appliedmaterials.com.
###
Contacts:
Connie Duncan (editorial/media) 408.563.6209
Michael Sullivan (financial community) 408.986.7977
PHOTO: Applied Centris? Sym3? Etch System:
http://hugin.info/143724/R/1937581/698468.jpg
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Source: Applied Materials via GlobeNewswire
[HUG#1937581]
Unternehmensinformation / Kurzprofil:
Datum: 13.07.2015 - 13:30 Uhr
Sprache: Deutsch
News-ID 406341
Anzahl Zeichen: 3739
contact information:
Town:
Santa Clara
Kategorie:
Business News
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