SOITEC AND SCREEN COLLABORATE TO DELIVER ATOMIC-SCALE UNIFORMITY ON 300MM FD-SOI SUBSTRATES
(Thomson Reuters ONE) -
Ability to Mass Produce FD-SOI Substrates Enables Cost-Efficient Fabrication
of High-Performance Semiconductor Devices
* Two industry leaders collaborate to produce atomic-scale uniformity
substrates
* Maximize FD-SOI production yields to meet worldwide market demand
* Top 10 equipment supplier joins FD-SOI growing ecosystem
San Francisco, Calif. (SEMICON West 2015), July 13, 2015 - Soitec (Euronext), a
world leader in designing and manufacturing semiconductor materials for the
electronics and energy industries, and SCREEN Semiconductor Solutions Co., a
leading manufacturer of advanced systems for the semiconductor industry, have
jointly developed a high-volume process to achieve atomic-scale uniformity of ±5
angstroms across the surface of all 300-mm fully depleted silicon-on-insulator
(FD-SOI) wafers. Atomic-level control of SOI substrate top silicon thickness
enables an excellent control of transistor geometry, key for fully depleted
technology. This collaborative success not only maximizes FD-SOI substrate
yields, but also represents another step in strengthening the global FD-SOI
ecosystem.
The ability to create uniform layers of channel silicon ensures FD-SOI device
performance and optimal electrical characteristics on all wafers surface. FD-SOI
technology leverages starting wafers - on which circuits are built - consisting
of an ultra-thin layer of top silicon over a thin buried oxide, with extremely
tight control of top silicon uniformity to within just a few atoms. These layers
form the active layers in the final transistor, and therefore must be as free of
defects and as planar as possible.
Using Soitec's Smart Cut(TM) technology and SCREEN 's cost-efficient, proven
robust single wafer-cleaner processing equipment compliant with FD-SOI
manufacturing requirements, Soitec is able to consistently produce highly
uniform FD-SOI wafers and will be able to do it in sufficient volume to meet the
global semiconductor industry's market demand. FD-SOI enables high performance
and power-efficiency for cost-sensitive processors in mobile, consumer,
automotive and networking markets.
"Our strategic partnership with SCREEN enables us to produce ultra-thin FD-SOI
substrates that meet chip makers' challenging requirements of atomic level
resolution in high volume manufacturing. Our FD-SOI wafers are already qualified
by a number of foundries," said Christophe Maleville, senior vice president of
Soitec's Digital Electronics Business Unit. "We are extremely pleased to see
such high support from SCREEN on FD-SOI manufacturing and we are looking forward
to finalize our on-going efforts on 14nm FD-SOI node."
"SCREEN is proud to collaborate with Soitec on meeting this advanced technical
challenge and enabling FD-SOI technology to reach high performance levels," said
Dr. Olivier Vatel, CTO of SCREEN Semiconductor Solutions Co., Ltd."Our high-
productivity cleaning systems are available and ready for the FD-SOI ecosystem.
As an industry leader, we will continue to deliver world-class products that
contribute to our customers' market success."
SCREEN's single-wafer cleaning equipment, the SU3200, delivers the industry's
best productivity by using a perfect balance of high-speed cleaning capacity and
highly stable processing. It has multiple process chambers, allowing each wafer
to be treated individually with its own dedicated recipe based on incoming layer
thicknesses, the desired surface condition to be achieved and a predictive etch
model. Key advantages of the system include highly uniform chamber-to-chamber
processing and cycle times for robust results, tight control of layer
thicknesses, the elimination of defects and metal contamination and high
productivity enabled by a versatile chemical-supply system.
About SCREEN Semiconductor Solutions: SCREEN Semiconductor Solutions has been
established as a group company of SCREEN Holdings. It inherits all of the
semiconductor equipment business from its predecessor, Dainippon Screen. On a
base of the core technologies in etching and photolithography that has been
cultivated over the years, it is a specialized manufacturer of semiconductor
production equipment in various areas such as wafer cleaning equipment,
lithography equipment and annealers, and is one of the world's top 10 suppliers.
For more information, please visit: www.screen.co.jp/eng/spe.
SCREEN Media contact :
Business Planning Dept.
+81-75-417-2527
speinfo(at)screen.co.jp
About Soitec: Soitec (Euronext, Paris) is a world leader in designing and
manufacturing semiconductor materials. The company uses its unique technologies
and semiconductor expertise to serve the electronics and energy markets. With
3,600 patents worldwide, Soitec's strategy is based on disruptive innovation to
answer its customers' needs for high performance, energy efficiency and cost
competitiveness. Soitec has manufacturing facilities, R&D centers and offices in
Europe, the U.S. and Asia. For more information, please visit www.soitec.com and
follow us on Twitter: (at)Soitec_EN and (at)Soitec_FR.
International Media Contact Investor Relations
Camille Dufour Steve Babureck
+33 (0)6 79 49 51 43 +1 858 519 6230
camille.dufour(at)soitec.com or +33 (0)6 16 38 56 27
steve.babureck(at)soitec.com
# # #
Press release (PDF):
http://hugin.info/143589/R/1938057/698772.pdf
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other applicable laws; and
(ii) they are solely responsible for the content, accuracy and
originality of the information contained therein.
Source: SOITEC via GlobeNewswire
[HUG#1938057]
Unternehmensinformation / Kurzprofil:
Datum: 13.07.2015 - 19:50 Uhr
Sprache: Deutsch
News-ID 406400
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