MEMS & Sensors Industry Group Brings Annual Technical Event to Europe
Conference Addresses Technical Challenges for the Next Decade of Growth in MEMS and Sensors, 7-8, March in Munich, Germany
(firmenpresse) - PITTSBURGH, PA -- (Marketwired) -- 02/04/16 -- (MSIG) members and invited guest speakers will address the most pressing design, integration and supply-chain challenges and opportunities affecting the growth of MEMS and sensors over the next decade during -- this year hosted in Munich, Germany.
"With the promise of trillions of connected devices by the close of this decade, there is great opportunity for those in the MEMS and sensors industry. But there are several technical challenges that still remain unsolved such as technology transfer, integration, packaging/test and use of new materials for emerging technologies such as flexible, printed electronics for applications in automotive, consumer, health and even agriculture," said Karen Lightman, executive director, MEMS & Sensors Industry Group. "At MEMS & Sensors Technical Congress, we will address these challenges to enable the industry to maximize its success. For two days, conference attendees will learn from the experiences of others as they explore some of the most critical issues in our industry."
MEMS & Sensors Industry Group Welcome -- Karen Lightman, executive director
-- Dr. -Ing. Dirk Wisselmann, senior engineer "Automated Driving" in the BMW Chassis and Driver-Assistance Development, BMW Group
-- Walter Schmidt, founder & CEO, PlantCare AG
-- Christophe Zinck, senior application engineering manager, ASE Group
-- Farzad Parsaie, founder and executive, SAND Microsystems
-- Claire Troadec, MEMS & semiconductor manufacturing analyst, Yole Développement
-- Richard Dixon, principal analyst, MEMS & Sensors, IHS
-- Andrew Baker-Campbell, technology consultant, The Technology Partnership
-- Pascal Langlois, CEO, Tronics Group
-- Rajashree Baskaran, senior technologist, Intel Corp
Moderator: Peter Merz, MEMS business manager, X-Fab Semiconductor Foundries AG
Panelists: Michael Murray, general manager, High-Performance Inertial, Analog Devices; Yannick Pilloux, business development manager for MEMS, Plasma-Therm; Markus Sonnemann, vice president of engineering (MEMS Pre-Development Department), Robert Bosch GmbH
Christoph Kutter, executive director, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT (Fraunhofer EMFT), will give attendees a guided tour of his research and development organization, which is leading innovation in sensor materials, silicon technologies, flexible electronics and microdosage systems -- and which supports integration and testing of electronic systems.
During his presentation, Printing and Hybrid Integration Technologies for Trillion Sensor Applications, Mr. Kutter will reference MSIG's recent as he addresses the MEMS and sensors industry's progress toward achieving a trillion sensors by 2020.
will actively engage attendees in one of three topic areas identified in the 2015 MSIG Membership Survey as the most critical issues facing the MEMS and sensors industry. Breakout session groups will focus on addressing these issues in the next two-five years in order to speed industry advancement and growth.
Breakout sessions include:
Challenges of Technology Transfer Moderators: Mary Ann Maher, president and CEO, SoftMEMS, and Dirk Ortloff, project manager XperiDesk, camLine
Common Challenges of MEMS, Sensors and Semiconductors -- Moderators: Jim Knutti, president and CEO, Acuity Incorporated, and Eric Pabo, business development manager, EV Group
Emerging MEMS and Sensors for the TSensors Era -- Moderators: Philippe Monnoyer, head of Microelectric Systems, VTT Technical Research Centre of Finland, and Jason Weigold, president, MEMStaff
MEMS & Sensors Technical Congress is a one-of-a-kind technical conference with a focus on discussing critical MEMS and sensors supply chain challenges. As the only event of its kind in Europe, MEMS & Sensors Technical Congress provides a place for neutral discussion of pre-competitive issues affecting MEMS and sensors manufacturing and brings together foundries, equipment vendors, research groups, large companies, start-ups, buyers, suppliers, and other stakeholders for solutions knowledge, networking and resources to support the imminent MEMS and sensors' commercialization needs of original equipment manufacturers (OEMs) and systems integrators.
Premier sponsors include: Platinum Sponsor -- ; Gold Sponsor -- ; Silver Sponsor -- ; and Bronze Sponsors -- , , and .
Supporting sponsors include: , and .
MEMS & Sensors Technology Congress will be held March 7-8, 2016 at , Munich, Germany. March 7 will feature sessions at Fraunhofer EMFT and a .
For more information, please contact MSIG via phone: +412.390.1644, email: or visit MEMS & Sensors Technical Congress at:
MEMS & Sensors Industry Group is the trade association advancing MEMS and sensors across global markets. Nearly 200 companies and industry partners comprise MEMS & Sensors Industry Group, including Analog Devices, Applied Materials, ARM, Bosch, EV Group, GE, GLOBALFOUNDRIES, HP, HTC Corporation, Huawei, Goertek, Infineon, Intel, InvenSense, Jawbone, Kionix, Knowles Corporation, Lenovo, NXP, OMRON Electronic Components, Qualcomm Technologies, Inc., SONY Electronics, SPTS Technologies, STMicroelectronics, Texas Instruments and TSMC. For more information, visit: .
MEMS & Sensors Industry Group and the MEMS & Sensors Industry Group logo are registered trademarks of MEMS & Sensors Industry Group. All other product and company names are trademarks or registered trademarks of their respective holders.
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Ellen Saksen
director of marketing
MEMS & Sensors Industry Group
Phone: +1 412-390-1644
Email:
Ingrid Daschner
Finn Partners
Phone: +49 (0)89 89 40 85-11
Email:
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Datum: 04.02.2016 - 11:00 Uhr
Sprache: Deutsch
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