New load lock for ergonomic wafer loading
SENTECH is proud to launch a new small footprint load lock that is now integrated in all SENTECH plasma deposition and etching systems. Pumping time, venting time as well as foot print of SENTECH plasma tools are reduced. Furthermore, the new load lock features ergonomic wafer loading.
(firmenpresse) - The load lock is designed for wafers up to 8” diameter. The base pressure is lower than 10 Pa using a small dry pump of 14 m3/h pumping speed. Optionally, a turbo pump (33 l/s) is available to reduce the base pressure down to 10-3 Pa. The wafer unloading time is reduced by a factor of 3 compared to former load lock.
Space in the laboratory is saved. Using the SCARA robot design (Selective Compliance Assembly Robot Arm) the size of the new load lock has been reduced by a factor of two. This great advantage is not the only one that highlights the new load lock. Loading and unloading of wafers is now more comfortable for the user.
The first plasma etching tools equipped with the new load lock were delivered to SENTECH users. High reliability and excellent performance are already proven in industrial environment.
Themen in dieser Pressemitteilung:
plasma-etching
plasma-deposition
load-lock
pecvd
plasma-process-technology
etching
deposition
rie-etching
reactive-ion-etching
cvd
Unternehmensinformation / Kurzprofil:
SENTECH offers leading edge plasma process technology equipment for etching, deposition and thin film measurement instrumentation based on ellipsometry. The advanced SENTECH plasma equipment is based on the inductively coupled plasma source PTSA (planar triple spiral antenna) which was developed by SENTECH for low damage and high rate etching and deposition. The latest product development at SENTECH expands the ICPECVD product line by plasma enhanced ALD systems and in situ monitoring systems.
Datum: 18.02.2016 - 13:51 Uhr
Sprache: Deutsch
News-ID 451553
Anzahl Zeichen: 1150
contact information:
Contact person: P. Romanowski
Town:
Berlin
Phone: +49 30 63 92 55 20
Kategorie:
Automotive
Typ of Press Release: Produktinformation
type of sending: Veröffentlichung
Date of sending: 18.02.2016
Diese Pressemitteilung wurde bisher 440 mal aufgerufen.
Die Pressemitteilung mit dem Titel:
"New load lock for ergonomic wafer loading"
steht unter der journalistisch-redaktionellen Verantwortung von
SENTECH Instruments GmbH (Nachricht senden)
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