Applied Materials Introduces New Era of Smart, Productive Chip Manufacturing with Centris(TM) Etch S

Applied Materials Introduces New Era of Smart, Productive Chip Manufacturing with Centris(TM) Etch System

ID: 49214

(Thomson Reuters ONE) -



* New smart platform architecture makes complex, shrinking chip designs
possible
* System intelligence enables angstrom-level uniformity on every wafer
* Nearly 2X faster than any other silicon etch system - with up to 30%
reduction in CoO


TOKYO, Japan, November 30, 2010 - Applied Materials, Inc. today begins a new era
in chip manufacturing with its powerfulApplied Centris(TM) AdvantEdge(TM)
Mesa(TM) Etch, the smartest, fastest silicon etch system ever made for the
volume production of the world's most advanced memory and logic chips. Featuring
an unprecedented eight process chambers - six etch and two plasma clean chambers
-  the compact Centris system can process up to 180 wafers per hour, lowering
the per-wafer cost by up to 30%. Proprietary system intelligence software
assures every process on every chamber precisely matches, delivering angstrom-
level uniformity on every wafer - a critical requirement for high yield in
tomorrow's highly-complex chip designs.

"The new Centris platform is a game-changer for silicon etch, one of the fastest
growing segments in the industry, as more and more critical etch steps are
required to create the ultra-small circuit features of advanced microchips,"
said Ellie Yieh, vice president and general manager of Applied's Etch Division.
"The combination of our new Centris platform with our world-class AdvantEdge
Mesa technology exemplifies how our customer-focused product innovation is
helping Applied gain momentum across multiple etch market applications."

The Applied Centris AdvantEdge Etch system also blazes a new path in green
processing. Delivering typical annual savings in power, water and gas
consumption equivalent to 600,000 pounds of CO2 emissions compared to currently
available silicon etch systems[1], the Centris system can help chipmakers lower




operating costs and support their sustainable manufacturing initiatives.

Applied will host a live webcast on November 30, 10:30 a.m. Japan time - Nov.
29, 5:30pm PST -  discussing this breakthrough technology
atwww.appliedmaterials.com/events/becauseinnovationmatters. The Centris platform
is one of several important technologies being announced by Applied during
SEMICON Japan 2010 in Chiba. More information, including multimedia resources,
can be found at Applied's online home at the show at
www.appliedmaterials.com/becauseinnovationmatters.

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. At Applied Materials, we turn today's innovations into the industries of
tomorrow. Learn more atwww.appliedmaterials.com.

[1] Calculated using SEMI S23 methodology

Contact:
Betty Newboe (editorial/media) 408.563.0647
Michael Sullivan (financial community) 408.986.7977


[HUG#1466756]








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Source: Applied Materials via Thomson Reuters ONE


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drucken  als PDF  an Freund senden  Freeholder's Energy Company Hosts Information Seminar on December 1st at Coast Harbourside Hotel & Marina in Victoria, B.C. - Video on www.InvestmentPitch.com Applied Materials Advances Etch Technology to Lower TSV Manufacturing Cost
Bereitgestellt von Benutzer: hugin
Datum: 29.11.2010 - 23:01 Uhr
Sprache: Deutsch
News-ID 49214
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