Applied Materials Extends RF PVD Technology to Enable 22nm Transistor Contacts
(Thomson Reuters ONE) -
SANTA CLARA, Calif., March 17, 2011 - Applied Materials, Inc. today announced it
has expanded its portfolio of applications for the Applied Endura(®) Avenir(TM)
RF PVD* system to include the deposition of nickel-platinum (NiPt) alloys,
enabling the scaling of transistor contacts to the 22nm technology node and
beyond. High-quality NiPt films for transistor contacts are essential for device
performance - but depositing material at the bottom of these high aspect ratio
(HAR) features is a significant challenge. To assure uniform contact resistance
and optimized yield, the Avenir system provides greater than 50% bottom coverage
in deep, 5:1 HAR contact holes - at up to 30% lower cost-per-wafer than
Applied's previous market-leading system.
"By extending the applications served by our benchmark RF PVD technology,
Applied continues to demonstrate its leadership in providing advanced
metallization solutions to our customers," said Prabu Raja, vice president and
general manager of the Metal Deposition Products business unit at Applied
Materials. "Applied's RF PVD technology offers chipmakers a low-risk path to
create robust, low-resistance transistor contacts using production-proven
technology to minimize development time. Avenir systems have already achieved
design-tool-of-record status for contact applications at multiple logic and
foundry customers."
Integrated on the highly-successful Endura platform, Applied's breakthrough
radio frequency-enhanced PVD technology, launched in 2010, enables chipmakers to
incorporate the latest metal gate transistor technology in their most advanced
high-performance logic devices. Incorporating a more powerful RF source, the
Avenir system allows manufacturers to deposit highly-uniform NiPt layers at the
bottom of narrow, deep contact holes less than 30nm in diameter - a capability
that is essential for reduced contact resistance and optimized transistor
performance.
To learn more about the Endura Avenir technology, visit
www.becauseinnovationmatters.com.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. At Applied Materials, we turn today's innovations into the industries of
tomorrow. Learn more atwww.appliedmaterials.com.
###
* RF PVD = radio frequency physical vapor deposition
Contact:
Betty Newboe (editorial/media) 408.563.0647
Michael Sullivan (financial community) 408.986.7977
The Applied Endura Avenir for 22nm Transistor Contact Fabrication:
http://hugin.info/143724/R/1497565/433295.jpg
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Source: Applied Materials via Thomson Reuters ONE
[HUG#1497565]
Unternehmensinformation / Kurzprofil:
Datum: 17.03.2011 - 12:32 Uhr
Sprache: Deutsch
News-ID 52527
Anzahl Zeichen: 3691
contact information:
Town:
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