ASM International N.V. to Host Interconnect Technology Seminar
(Thomson Reuters ONE) -
ALMERE, The Netherlands - May 06, 2011 - ASM International N.V. (NASDAQ: ASMI
and Euronext Exchange in Amsterdam: ASM) will host an interconnect technology
seminar addressing process induced damage and electrical integrity of Ultra Low-
k materials, on Monday, May 9, 2011 at the International Congress Center
Dresden. The seminar is being held in conjunction with the IEEE International
Interconnect Technology Conference (IITC) and the Materials for Advanced
Metallization Conference (MAM).
At the seminar, invited speaker Boyan Boyanov, Components Research at Intel
Corporation, will discuss "Implications of process-induced damage and dielectric
breakdown for ULK materials at sub-20nm process technology nodes".
To start the program, Ivo Raaijmakers, CTO at ASM will speak about
"Towards integration of k=2 materials".
The ASM technology seminar will take place in the Seminar room 3&4.
The room will open at 06:30 PM for invited attendees. Those interested in
attending this event should reply by e-mail to IITC.Seminar(at)asm.com by May 8.
About ASM International
ASM International N.V., headquartered in Almere, the Netherlands, and its
subsidiaries design and manufacture equipment and materials used to produce
semiconductor devices. ASM International and its subsidiaries provide production
solutions for wafer processing (Front-end segment) as well as assembly and
packaging (Back-end segment) through facilities in the United States, Europe,
Japan and Asia. ASM International's common stock trades on NASDAQ (symbol ASMI)
and the Euronext Amsterdam Stock Exchange (symbol ASM). For more information,
visit ASMI's website atwww.asm.com.
Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of
1995: All matters discussed in this statement, except for any historical data,
are forward-looking statements. Forward-looking statements involve risks and
uncertainties that could cause actual results to differ materially from those in
the forward-looking statements. These include, but are not limited to, economic
conditions and trends in the semiconductor industry generally and the timing of
the industry cycles specifically, currency fluctuations, financing and liquidity
matters, the success of restructurings, the timing of significant orders, market
acceptance of new products, competitive factors, litigation involving
intellectual property, shareholder and other issues, commercial and economic
disruption due to natural disasters, terrorist activity, armed conflict or
political instability, epidemics and other risks indicated in the Company's
filings from time to time with the U.S. Securities and Exchange Commission,
including, but not limited to, the Company's reports on Form 20-F and Form 6-K.
The Company assumes no obligation nor intends to update or revise any forward-
looking statements to reflect future developments or circumstances.
Contact:
Rosanne de Vries
+31 (0)651 252448
+31 (0)8810 08569
ASM International N.V. to Host Interconnect Technology Seminar:
http://hugin.info/132090/R/1513327/449126.pdf
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Source: ASM International NV via Thomson Reuters ONE
[HUG#1513327]
Unternehmensinformation / Kurzprofil:
Datum: 06.05.2011 - 15:00 Uhr
Sprache: Deutsch
News-ID 54374
Anzahl Zeichen: 4066
contact information:
Town:
Almere
Kategorie:
Business News
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