MicroBT employs Moortec’s 16nm Embedded Temperature Sensor in their HPC ASIC
(firmenpresse) - Plymouth, UK, 29th November 2018 Moortec, providers of complete In-Chip Monitoring PVT Subsystems today announced that Shenzhen MicroBT Electronics Technology Co., Ltd. have employed Moortec’s 16FFC Temperature Sensor IP in their latest high performance computing (HPC) ASIC.
HPC is highly intensive in terms of CPU activity and requires ever increasing levels of computing power. This increased power consumption requires more electricity and this leads to much higher levels of heat generation. All this energy consumption equates to the costs of successfully implementing HPC easily becoming prohibitive.
As the CPU temperatures rise the power consumption of HPC machine ASIC drastically increases, therefore real time temperature monitoring systems are necessary to allow for power optimization. In-chip embedded temperature sensors help extend device lifetimes and provide protection through the enablement of shutdown schemes, the latter being as a result of rising temperatures from sudden increases in dynamic CPU load profiles.
Companies like MicroBT are meeting these challenges by creating cost effective, highly efficient and functional HPC machines that can deal with the increased level of heat by employing such embedded temperature sensors in areas with known hotspots on the die.
“The quality of the product is very high in all respects. Accurate temperature monitoring and management can enable products to deal with all kinds of challenges in extreme environments. The outstanding performance of Moortec’s solution gives us more confidence to face these types of environments and maintain our high quality in the mass production stage” said Guo Haifeng who is R&D header of MicroBT.
Ramsay Allen, VP of Marketing at Moortec, said “We are excited to be able to support companies like MicroBT who are working in the exciting field of HPC. MicroBT is a major innovator in this ever growing field and we are proud to support their projects with our best-in-class embedded monitoring solutions.”
Themen in dieser Pressemitteilung:
Unternehmensinformation / Kurzprofil:
About MicroBT Electronics Technology Co., Ltd.
Established in 2016 and headquartered in Shenzhen, Shenzhen MicroBT Electronics Technology Co., Ltd. (hereinafter referred to as “MicroBT”) is a high-tech company in capable of designing and selling ASIC-based products built upon 28nm/16nm/7nm process. Boasting ASICs and related products with its own intellectual property, MicroBT dedicates itself to deep exploration in ASIC design, blockchain technology, cloud computing and artificial intelligence. Being good at deployment and operation of cloud computing data centers, it serves big-data processing and application areas such as cloud computing, artificial intelligence, and blockchain.
For more information visit the MicroBT website: www.microbt.com
About Moortec
Established in 2005, Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies on 40nm, 28nm, 16nm, 12nm and 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimisation, enabling schemes such as DVFS, AVS and power management control systems. Moortec provides excellent support for IP application, integration and device test during production. Moortec’s high-performance analog and mixed-signal IP designs are delivered to ASIC and System on Chip (SoC) technologies within the consumer, mobile, automotive, high performance computing and telecommunications sectors.
For more information please contact Ramsay Allen ramsay.allen(at)moortec.com, +44 1752 875133, visit www.moortec.com and follow us on Twitter (at)moortec and LinkedIn.
Datum: 29.11.2018 - 11:52 Uhr
Sprache: Deutsch
News-ID 584758
Anzahl Zeichen: 2101
contact information:
Contact person: Courtney Dean
Town:
Lincoln
Phone: 01522 883 640
Kategorie:
Electronic Components
Typ of Press Release: please
type of sending: don't
Diese Pressemitteilung wurde bisher 357 mal aufgerufen.
Die Pressemitteilung mit dem Titel:
"MicroBT employs Moortec’s 16nm Embedded Temperature Sensor in their HPC ASIC"
steht unter der journalistisch-redaktionellen Verantwortung von
RealWire (Nachricht senden)
Beachten Sie bitte die weiteren Informationen zum Haftungsauschluß (gemäß TMG - TeleMedianGesetz) und dem Datenschutz (gemäß der DSGVO).
