With New USB and Ethernet Products, SMSC Offers The Most Comprehensive Portfolio For A Connected Car

With New USB and Ethernet Products, SMSC Offers The Most Comprehensive Portfolio For A Connected Car

ID: 7143

Hauppauge, New York - October 21, 2009 - SMSC (NASDAQ:
SMSC), a leading semiconductor company providing Smart
Mixed-Signal Connectivity(tm) solutions, today announced that
it is now delivering a comprehensive portfolio of automotive
connectivity products for a digital car. With the extension of its
TrueAuto(tm) USB and Ethernet product set, SMSC is the only
company offering a full suite of automotive technologies that
complement the Media Oriented Systems Transport (MOST(r))
infotainment backbone. TrueAuto, SMSC's proven quality
process, goes far beyond the stress tests prescribed by the AEC-
Q100 specifications, so that products are designed, fabricated,
tested, characterized, qualified and supported from the ground
up for automotive-grade reliability.

(firmenpresse) - With the industry's widest selection of quality ICs, software,
tools, reference designs and consulting, SMSC is a one-
stop-shop for automotive infotainment connectivity.

Today, SMSC added two new products to its TrueAuto
offering-the USB83340, a USB 2.0 UTMI+ low-pin interface
(ULPI) transceiver and the LAN89303, a 10/100 3-port
managed Ethernet switch. Designed to meet the stringent
requirements of the automotive industry, these new
products complement the existing TrueAuto suite, which
includes a Hi-Speed USB 2.0 hub controller, a USB 2.0
hub/card reader combo, an MII/RMII 10/100 Ethernet
transceiver and single-chip 10/100 Ethernet controller, all
announced earlier this year. These TrueAuto products join
SMSC's various MOST IC products long used by the
automotive industry.

"Car makers need to anticipate rapidly changing consumer
behavior to design vehicles that fit their customers' digital
lifestyles," said Christian Thiel, Vice President and General
Manager of SMSC's Automotive Information Systems
group. "USB provides a fast, plug-and-play connection to
consumers' multimedia devices while Ethernet connects the
vehicle to the IT infrastructure of service shops for accurate
diagnostics and fast software download. MOST provides a
reliable backbone within the vehicle to bring these various
interfaces together and network the infotainment
components that are mounted into the car. SMSC has long-
standing experience with all of these technologies to help
automotive OEMs select between different connectivity
configurations. With highly reliable and widely compatible
connectivity solutions and more than a decade of
experience supplying the automotive industry, SMSC is a
trustworthy partner to the world's leading car makers and
their suppliers."

As one of the largest and longest-term USB component




manufacturers, SMSC has a broad portfolio that ensures
compatibility with the bulk of devices that the consumer
could possibly bring into the car. To date, SMSC has
shipped more than 250 million USB chips and is at the
forefront of the USB evolution to SuperSpeed USB, or USB
3.0, which brings significant opportunity for designers to
create high-performance, differentiated products for
consumers. USB 3.0's bandwidth and advanced features
position the USB hub as the central I/O component for all
types of communications within and among media devices,
increasing USB ubiquity and value to consumers. SMSC's
goal is to help designers take advantage of the potential of
USB 3.0 to allow them to deliver compelling consumer
products that are faster, smaller and more energy efficient.
As USB 3.0 is deployed in the marketplace, SMSC expects
to lead the way in making automotive solutions available
that deliver the speed and quality of transmission that
consumers expect wherever they connect.

Availability:
Engineering samples of the USB83340 are available now.
LAN89303 engineering samples will be available in the
first quarter of the 2010 calendar year. Contact your SMSC
sales representative today for more information.


IMAGE: SMSC’s TrueAuto quality process goes far beyond
the typical automotive quality standards. SMSC’s proven
quality process, goes far beyond the stress tests prescribed
by the AEC-Q100 specifications, so that products are
designed, fabricated, tested, characterized, qualified and
supported from the ground up for automotive-grade
reliability.
PREVIEW: http://www.hueggenberg.com/en/news/news-
SMSC-12-TrueAuto.htm
DOWNLOAD:
http://www.hueggenberg.com/images/SMSC/TrueAuto-
logo.eps (0.7 MB)


About TrueAuto:
SMSC's TrueAuto quality process goes far beyond the
typical automotive quality standards. Integrated circuits
("ICs") designed for automotive applications are usually
qualified according to the Automotive Electronics Council's
(AEC-Q100) requirements. Because AEC-Q100 covers
minimum common requirements for the qualification of an
automotive IC, many car companies and tier-one
automotive suppliers require additional qualification tests
to ensure ultra-low defect rates. In addition, AEC-Q100
primarily focuses on the qualification phase of the product
cycle of an IC. Other phases such as IC design and
production, customer support and the handling and
investigation of returns are not covered in detail. In order to
reach the automotive goal of near-zero defect rates, all
phases of the IC product cycle need to be addressed
thoroughly.

TrueAuto uses a proven total approach to deliver leading
edge quality and services to satisfy the most demanding
automotive customers. TrueAuto robustness begins with
SMSC's design for reliability techniques that build
automotive-grade excellence and testability into the IC.
The IC is fully characterized over many operating
parameters to validate that the quality of the design meets
or exceeds AEC-Q100 reliability standards and customer
specific requirements. In addition, SMSC employs
extensive technologies and processes, such as enhanced
process monitors, during fabrication of TrueAuto products in
order to drive continuous improvements in accordance with
SMSC's zero Defects per Million (DPM) goals.

Forward Looking Statements
Except for historical information contained herein, the
matters discussed in this announcement are forward-looking
statements about expected future events and financial and
operating results that involve risks and uncertainties. These
uncertainties may cause our actual future results to be
materially different from those discussed in forward-looking
statements. Our risks and uncertainties include the timely
development and market acceptance of new products; the
impact of competitive products and pricing; our ability to
procure capacity from our suppliers and the timely
performance of their obligations, commodity prices, interest
rates and foreign exchange, potential investment losses as
a result of liquidity conditions, the effects of changing
economic and political conditions in the market
domestically and internationally and on our customers; our
relationships with and dependence on customers and
growth rates in the personal computer, consumer electronics
and embedded and automotive markets and within our
sales channel; changes in customer order patterns,
including order cancellations or reduced bookings; the
effects of tariff, import and currency regulation; potential or
actual litigation; and excess or obsolete inventory and
variations in inventory valuation, among others. In addition,
SMSC competes in the semiconductor industry, which has
historically been characterized by intense competition,
rapid technological change, cyclical market patterns, price
erosion and periods of mismatched supply and demand.

Our forward looking statements are qualified in their
entirety by the inherent risks and uncertainties surrounding
future expectations and may not reflect the potential
impact of any future acquisitions, mergers or divestitures.
All forward-looking statements speak only as of the date
hereof and are based upon the information available to
SMSC at this time. Such statements are subject to change,
and the Company does not undertake to update such
statements, except to the extent required under applicable
law and regulation. These and other risks and uncertainties,
including potential liability resulting from pending or future
litigation, are detailed from time to time in the Company's
reports filed with the SEC. Investors are advised to read the
Company's Annual Report on Form 10-K and quarterly
reports on Form 10-Q filed with the Securities and
Exchange Commission, particularly those sections entitled
"Other Factors That May Affect Future Operating Results" or
"Risk Factors" for a more complete discussion of these and
other risks and uncertainties.

Unternehmensinformation / Kurzprofil:

About SMSC
SMSC is a leading developer of Smart Mixed-Signal
Connectivity(tm) solutions. SMSC employs a unique
systems level approach that incorporates a broad set of
technologies and intellectual property to deliver
differentiating products to its customers. The company is
focused on delivering connectivity solutions that enable the
proliferation of data in personal computers, automobiles,
portable consumer devices and other applications. SMSC's
feature-rich products drive a number of industry standards
and include USB, MOST(r) automotive networking,
embedded system control and analog solutions, including
thermal management and RightTouch(tm) capacitive
sensing. SMSC is headquartered in New York and has
offices and research facilities in North America, Asia,
Europe and India. Additional information is available at
www.smsc.com.

SMSC and MOST are registered trademarks and Smart
Mixed-Signal Connectivity, TrueAuto and RightTouch are
trademarks of Standard Microsystems Corporation.



Leseranfragen:

SMSC Automotive Information Systems
Rolf Hoffmeyer-Zlotnik
Bannwaldallee 48
76185 Karlsruhe (Germany)
T +49 721 625 37 224
E Rolf.Hoffmeyer-Zlotnik(at)smsc.com
W www.smsc.com



PresseKontakt / Agentur:

hueggenberg gbr
Mandy Ahlendorf
T +49 8151 55 50 09 11
E presse(at)hueggenberg.com



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Bereitgestellt von Benutzer: ahlendorf
Datum: 21.10.2009 - 21:21 Uhr
Sprache: Deutsch
News-ID 7143
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Kategorie:

Electronics & Semiconductors


Typ of Press Release: Produktinformation
type of sending: Veröffentlichung
Date of sending: 21.10.2009

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