Skyviia Chooses Tensilica's HiFi Audio DSP
(firmenpresse) - HSINCHU CITY, TAIWAN -- (Marketwire) -- 11/15/11 -- Tensilica®, Inc. today announced that Skyviia Corporation, a multimedia IC design company, has selected the HiFi Audio DSP core for its next-generation multimedia SOC (system-on-chip) designs.
Tensilica's HiFi Audio DSP is the most popular audio DSP core on the market and is licensed by five of the top 10 semiconductor companies and many leading system OEMs. The HiFi Audio DSP solution includes over 80 audio decoders, encoders and audio-enhancement software packages for efficient audio processing for applications ranging from low power mobile devices -- such as cell phones and MP3 players -- to high performance home entertainment systems, set-top boxes, Blu-ray Disc players/recorders, and high-definition televisions. The HiFi Audio DSP is part of Tensilica's growing line of dataplane processors (DPUs) that do the challenging, compute-intensive tasks in SOC designs.
"We selected the HiFi Audio DSP because it had the best combination of high performance, speed, and low power," stated Brian Sung, executive vice president, Skyviia. "And we were particularly impressed with the huge library of audio codecs already ported and optimized for this architecture."
"Skyviia is an up-and-coming multimedia supplier for the Android platform and other portable multimedia devices," stated Larry Przywara, Tensilica's senior director of multimedia marketing. "We look forward to seeing their innovative designs that employ our HiFi audio processor."
Skyviia Corporation, a multimedia IC design company, is the market pioneer in SOC solutions for innovative digital multimedia products. For more information, visit .
Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane processors combine the best capabilities of DSP and CPU while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, storage, networking, wireless base station and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit .
Editors' Notes:
Tensilica and Xtensa are registered trademarks belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.
Tensilica's announced licensees include: Afa Technologies, ALPS, Aquantia, Astute Networks, Atheros, AMD, Avision, Bay Microsystems, Brocade, Broadcom, Cavium, Chelsio, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, EE Solutions, Enverv, Epson, Fujitsu Ltd., Fujitsu Microelectronics, Huawei, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell, Maxim, NEC Corporation, Nethra Imaging, Novatek, NuFront, Olympus Optical Co. Ltd., Panasonic Mobile, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Samsung, SiBEAM, Sirius XM Radio, Skyviaa, Sony, Stretch, TranSwitch Corporation, Triductor Technology, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), and Wolfson Microelectronics.
Paula Jones
(408) 327-7343
Erika Powelson
(831) 424-1811
Brian Sung
886-3-5783858 Ext. 6200
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Datum: 15.11.2011 - 13:00 Uhr
Sprache: Deutsch
News-ID 87885
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