Applied Materials Announces Atomic-Level Film Treatment to Reduce Chip Power Consumption
(Thomson Reuters ONE) -
* Innovative film treatment improves chip wiring insulation to enable longer
battery life for mobile devices
* Advances low k technology for scaling logic chips to 22nm node and beyond
* Increases mechanical strength of chip for higher packaging yield
* Executive presentation now available on www.becauseinnovationmatters.com
SANTA CLARA, Calif., November 29, 2011 - Applied Materials, Inc. today announced
a breakthrough technology for reducing power consumption in semiconductor chips
with its new Applied Producer(®) Onyx(TM) film treatment system. By optimizing
the molecular structure of the low k films that insulate the miles of wiring, or
interconnects, on each chip, the Producer Onyx system enables customers to
continue their relentless drive to fabricate faster, more power-efficient logic
devices as they scale to 22nm and below.
"The interconnect represents approximately one-third of the total power consumed
by a chip and reducing this power is essential to achieving higher performance
and longer battery life in advanced logic devices," said Bill McClintock, vice
president and general manager of Applied's Dielectric Systems and Modules
business unit. "With the Onyx system, we're offering a unique treatment
capability that delivers the most power-efficient interconnects in the industry,
while increasing mechanical strength, making the chip robust to better withstand
the challenge of emerging 3-D packaging applications. Multiple Producer Onyx
systems are already in pilot production for advanced logic device
manufacturing."
With each successive technology node, interconnect wires get closer to one
another, increasing the potential for parasitic capacitance, or crosstalk,
between adjacent lines - which wastes power and restricts switching speed.
Reducing capacitance, by lowering the k-value of the insulating material that
separates and supports these structures, is a key component in ensuring
continued improvement in performance and battery life.
Applied's proprietary Onyx technology drives carbon and silicon into the porous
dielectric film to reinforce the insulating material at the atomic level. The
treatment decreases the k-value by up to 20%, delivering a significant reduction
in chip power consumption. In addition, the process increases the stiffness of
the dielectric, enabling it to withstand the stress of hundreds of subsequent
processes and packaging steps. For more information on the Applied Producer Onyx
film treatment system, visit
www.appliedmaterials.com/technologies/library/producer-onyx.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. At Applied Materials, we turn today's innovations into the industries of
tomorrow. Learn more at www.appliedmaterials.com.
# # #
Contact:
Connie Duncan (editorial/media) 408.563.6209
Michael Sullivan (financial community) 408.986.7977
The breakthrough Applied Prodcucer Onyx film treatment system:
http://hugin.info/143724/R/1566859/486817.jpg
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Source: Applied Materials via Thomson Reuters ONE
[HUG#1566859]
Unternehmensinformation / Kurzprofil:
Datum: 29.11.2011 - 13:31 Uhr
Sprache: Deutsch
News-ID 92041
Anzahl Zeichen: 4222
contact information:
Town:
Santa Clara
Kategorie:
Business News
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