DGAP-News: Consortium to Accelerate Dramatic Advances in Memory Technology Announces New Members
(firmenpresse) - Micron Technology, Inc.
27.06.2012 14:00
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ARM, HP and SK hynix Join Collaboration for Hybrid Memory Cube (HMC) Technology
BOISE, Idaho, 2012-06-27 14:00 CEST (GLOBE NEWSWIRE) --
The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology (Nasdaq:MU)
and Samsung Electronics Co., Ltd., today announced that new members ARM, HP,
and SK hynix, Inc. have joined the global effort to accelerate widespread
industry adoption of Hybrid Memory Cube (HMC) technology. The HMCC is a
collaboration of original equipment manufacturers (OEMs), enablers and
integrators who are cooperating to develop and implement an open interface
standard for the innovative new memory technology.
Micron and Samsung, the initial developing members of the HMCC, are working
closely with Altera, IBM, Microsoft, Open-Silicon, Xilinx and now ARM, HP and
SK hynix - to draft an industry-wide specification that should pave the way for
a wide range of electronic advances.
'The strong collection of companies who have joined the consortium -
representing a broad range of technology interests - reflects the perceived
high value of HMC as the next standard for high-performance memory
applications,' said Robert Feurle, Micron's vice president for DRAM marketing.
'With the addition of ARM, HP and SK hynix as developers, who will help to
determine the specific features, the consortium is well positioned to provide a
new open standard for next-gen electronics.'
HMC features will enable highly efficient memory solutions for applications
ranging from industrial products to high-performance computing and large-scale
networking. The HMCC's team of developers plans to deliver a draft interface
specification to the growing number of 'adopters' joining the consortium. Then,
the combined team of developers and adopters will refine the draft and release
a final interface specification, currently targeted for the end of this year.
As envisioned, HMC capabilities will leap beyond current and near-term memory
architectures in the areas of performance, packaging and power efficiencies,
offering a major alternative to present memory technology.
One of the primary challenges facing the industry -- and a key motivation for
forming the HMCC -- is that the memory bandwidth required by high-performance
computers and next-generation networking equipment has increased beyond what
conventional memory architectures can provide. The term 'memory wall' has been
used to describe this challenge. Breaking through the memory wall requires
architecture such as HMC that can provide increased density and bandwidth with
significantly lower power consumption.
Adopter membership in the HMCC is available to any company interested in
joining the consortium and participating in the specification development.
Already, the HMCC has responded to interest from more than 90 prospective
adopters.
Additional information, technical specifications, tools and support for
adopting the technology can be found at www.hybridmemorycube.org.
About the HMCC
Founded by leading members of the world's semiconductor community, the Hybrid
Memory Cube Consortium (HMCC) is dedicated to the development and establishment
of an industry-standard interface specification for the Hybrid Memory Cube
technology. Members of the consortium include Altera, ARM, HP, IBM, SK hynix,
Micron, Microsoft, Open-Silicon, Samsung, and Xilinx. More than 90 prospective
adopters are exploring consortium membership. To learn more about the HMCC,
visit www.hybridmemorycube.org.
CONTACT: Scott Stevens
Micron Technology, Inc.
+1.512.288.4050
sstevens(at)micron.com
John Lucas
Samsung Electronics Co., Ltd.
408-544-4363
j.lucas(at)ssi.samsung.com
News Source: NASDAQ OMX
27.06.2012 Dissemination of a Corporate News, transmitted by DGAP -
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Language: English
Company: Micron Technology, Inc.
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ISIN: US5951121038
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