Event Advisory: Semiconductor Industry Leaders to Examine the Future of Interconnects at December 11th Event
(Thomson Reuters ONE) -
SANTA CLARA, Calif., December 3, 2012 - The 14 nanometer node is expected to be
an inflection point for the chip industry, beyond which the resistivity of
copper interconnects will increase exponentially and may become a limiting
factor in chip design. On December 11, 2012, Applied Materials, Inc. will host
an important forum in San Francisco to explore the path that interconnect
technology must take to keep pace with transistor scaling and the transition to
new 3D architectures.
The discussion will address critical questions for the semiconductor industry,
including the possibility of replacing copper as the material of choice for
interconnect structures. If not, will new circuit designs and system
architectures be able to address future limitations in interconnect performance?
The complexity of multi-patterning and EUV timing may also impact chipmakers'
interconnect pitch scaling roadmaps.
Guest speakers from across the industry will provide insights on these critical
issues in a panel titled "Interconnect Performance - Overcoming the Impact of
Transistor Scaling." To register for this exceptional event, please visit
www.appliedmaterials.com/interconnect-panel.
Introduction: Vice president and chief technology
Klaus Schuegraf, Ph.D. officer, Silicon Systems Group, Applied
Materials, Inc.
Panel: Robert Aitken, Ph.D. Fellow, ARM Holdings, Ltd.
Jon Candelaria Director, interconnect and packaging
sciences, Semiconductor Research Corp.
Dinesh Somasekhar, Ph.D. Senior scientist, Intel Corp.
Zsolt Tokei, Ph.D. Program director, nano interconnects, IMEC
Mehul Naik, Ph.D. Distinguished member of technical staff,
Applied Materials, Inc.
Douglas Yu, Ph.D. Senior director, backend R&D, TSMC, Ltd.
David Lammers (moderator) Contributing editor, SemiMD.com
Where: Hotel Nikko
222 Mason Street, San Francisco, CA 94102
When: Tuesday, December 11, 2012
Schedule: 5:00pm - 6:15pm Registration and Reception
6:15pm - 7:40pm Panel Discussion
7:40pm - 8:00pm Beverages/Social
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. Learn more at www.appliedmaterials.com.
# # #
Contact:
Connie Duncan (editorial/media) 408.563.6209
Michael Sullivan (financial community) 408.986.7977
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Source: Applied Materials via Thomson Reuters ONE
[HUG#1661592]
Unternehmensinformation / Kurzprofil:
Datum: 03.12.2012 - 13:30 Uhr
Sprache: Deutsch
News-ID 208968
Anzahl Zeichen: 3790
contact information:
Town:
Santa Clara
Kategorie:
Business News
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"Event Advisory: Semiconductor Industry Leaders to Examine the Future of Interconnects at December 11th Event"
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