SUSS MicroTec Japan Seminar in Tokyo addressed critical challenges for 3D Integration and Next Generation Lithography
(firmenpresse) - (DGAP-Media / 05.12.2012 / 10:41)
PRESS RELEASE
SUSS MicroTec Japan Seminar in Tokyo addressed critical challenges for 3D
Integration and Next Generation Lithography
Garching, December 5, 2012 - SUSS MicroTec, a global supplier of equipment
and process solutions for the semiconductor industry and related markets,
hosted the SUSS MicroTec Japan Seminar 2012 on December 4, at the Hyatt
Regency Tokyo. In two parallel tracks the latest developments in 3D
Integration and Next Generation Lithography as 193i, EUVL and NIL were
presented and discussed. Both seminars attracted approximately 200
attendees.
The very well attended seminar on 3D Integration addressed the latest
developments in 2.5D/3D Packaging. Industry leading companies and market
research institutes like Yole Développement shared their views on the
technology road map and on the 3DIC market for high performance computer&server networks, smartphones and tablets. These applications have been
identified as today's major market drivers.
The Next Generation Lithography (NGL) seminar focused on advances in mask
manufacturing technologies. The industry still faces significant challenges
for EUVL pilot lines and their future introduction to high volume
manufacturing. This Session spot-lighted on EUVL challenges including
critical processes from the mask prospective. In addition, the session
touched on other lithography solutions such as 193i extension, Nano Imprint
Lithography and Direct Self Assembly (DSA).
'On one hand Moore's Law is demanding further shrinking and drives EUVL as
well as alternative lithography technologies, but on the other hand 2.5D/3D
Integration gains importance and is in the strategic focus of many global
players. We hosted this Seminar to present our solutions on both sides and
to discuss remaining technological challenges with customers and
cooperation partners', says Frank P. Averdung, President and CEO of SUSS
MicroTec. 'We presented our solutions for thin wafer handling, wafer
bonding and our leading mask processing technology. We also introduced new
technological capabilities, such as Tamarack's UV-Projection Lithography
and Laser Processing Technology.'
The Forum on 3D Integration featured representatives from the Industrial
Technology Research Institute (ITRI), Yole Développement, Interconnection
Technologies, Fujitsu, Tokyo University, Thin Materials AG, Brewer Science,
D-Process, Toray Engineering, Cookson Electronics and Electroplating
Engineers of Japan (EEJA). The Next Generation Lithography Session featured
representatives from Toshiba, Dai Nippon Printing, Toppan Printing,
Gigaphoton, FUJIFILM, Asahi Glass, Nuflare Technology and Molecular
Imprint.
About SUSS MicroTec
SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading
supplier of equipment and process solutions for microstructuring in the
semiconductor industry and related markets. In close cooperation with
research institutes and industry partners SUSS MicroTec contributes to the
advancement of next-generation technologies such as 3D Integration and
nanoimprint lithography as well as key processes for MEMS and LED
manufacturing. With a global infrastructure for applications and service
SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS
MicroTec is headquartered in Garching near Munich, Germany. For more
information, pleasevisit http://www.suss.com
Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke(at)suss.com
End of Media Release
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Issuer: SÜSS MicroTec AG
Key word(s): Enterprise
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---------------------------------------------------------------------
Language: English
Company: SÜSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: ir(at)suss.com
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Indices: TecDAX
Listed: Regulierter Markt in Frankfurt (Prime Standard);
Freiverkehr in Berlin, Düsseldorf, Hamburg, München,
Stuttgart
End of News DGAP-Media
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