STMicroelectronics Signs Loan Agreement with the European Investment Bank
(Thomson Reuters ONE) -
PR N° C2710C
STMicroelectronics Signs Loan Agreement
with the European Investment Bank
* Euro 350 million multicurrency facility supports ST's R&D investments in
Power, MEMS and Sensors, Microcontrollers, Advanced Analog and Healthcare
high-growth applications
* Euro 350 million floating-rate senior bonds repaid on March 17(th )with
available resources
* ST capital structure further strengthened
Geneva, March 26, 2013 - STMicroelectronics (NYSE:STM), a global semiconductor
leader serving customers across the spectrum of electronics applications, has
signed a new Euro 350 million loan agreement with the European Investment Bank
(EIB). The facility, which has not yet been drawn by ST, is also available in
the US$ equivalent amount and has an option for disbursement until September
2014 with final maturity eight years after disbursement.
This new facility, which further strengthens the long-established relationship
between ST and EIB, supports ST's activities in R&D and innovation related to
the design and realization of the next generation of technologies and electronic
devices for applications in Power, MEMS, Microcontrollers, Advanced Analog and
Healthcare. This includes the full cycle from technology R&D and product
development to application solutions that include software development and
systems integration. These activities are mainly carried out in ST's Italian
sites of Agrate Brianza, Castelletto and Catania.
Furthermore, on March 17(th), 2013, ST repaid with available cash the residual
Euro 350 million floating-rate senior bonds outstanding with a principal amount
of Euro 500 million at issuance. ST's capital structure, already supported by a
net cash position of about US$ 1.19 billion at the end of Q4 2012, and existing
committed credit lines for about US$ 490 million, has been further strengthened
by this new credit facility from the EIB.
About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and office,
at work and at play, ST is found everywhere microelectronics make a positive and
innovative contribution to people's life. By getting more from technology to get
more from life, ST stands for life.augmented.
In 2012, the Company's net revenues were $8.49 billion. Further information on
ST can be found at www.st.com
For further information, please contact:
INVESTOR RELATIONS:
Tait Sorensen
Group VP, Investor Relations
STMicroelectronics
Tel: +1 602 485 2064
tait.sorensen(at)st.com
MEDIA RELATIONS:
Nelly Dimey
Director, Corporate Media and Public Relations
STMicroelectronics
Tel: +33 1 58 07 77 85
nelly.dimey(at)st.com
ST EIB Loan Agreement:
http://hugin.info/152740/R/1688060/553676.pdf
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Source: STMicroelectronics via Thomson Reuters ONE
[HUG#1688060]
Unternehmensinformation / Kurzprofil:
Datum: 26.03.2013 - 08:01 Uhr
Sprache: Deutsch
News-ID 242985
Anzahl Zeichen: 3977
contact information:
Town:
Geneva
Kategorie:
Business News
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