Environment friendly Laser Processing in Advanced Packaging gains Pace - Leading US-American IDM places Order for Excimer Laser Ablation Tool
(firmenpresse) - (DGAP-Media / 17.04.2013 / 14:15)
Environment friendly Laser Processing in Advanced Packaging gains Pace -
Leading US-American IDM places Order for Excimer Laser Ablation Tool
Garching, April 17, 2013 - SUSS MicroTec, a leading supplier of equipment
and process solutions for the semiconductor and related markets, has
received a purchase order for their latest generation laser ablation
stepper from a leading US-American IDM (Integrated Device Manufacturer).
This important sale re-states the increasing importance of this technology
in advanced packaging, adding to the recent shipments of the same platform
to another IDM and a major Asian OSAT (Outsourced Assembly and Test
Foundry). This ELP300 Excimer laser platform is designed for high volume
manufacturing and processing of wafer sizes between 200 and 300mm,
employing Excimer laser technology to directly create microstructures in
lieu of traditional photolithography and wet etch approaches. The advantage
of this system is the ability to not only address the challenges in
manufacturing next generation semiconductor packages, but also address a
means to lower manufacturing costs. This technology is environment friendly
as it eliminates the need for wet etching process steps utilizing toxic
materials. Shipment of this system is scheduled for Q4 2013.
'The placement of the order underpins the rising importance of this new and
innovative structuring technology for the semiconductor mid- and backend.',
says Frank P. Averdung, President and CEO of SUSS MicroTec. 'We see high
growth potential for this technology, especially in our core market of
advanced packaging. Besides offering a considerable cost savings potential,
this 'green' Excimer laser processing technology will enable our customers
the ability to design and produce even more powerful microchips and
packages in the future while reducing the burden on the environment.'
About SUSS MicroTec
SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading
supplier of equipment and process solutions for microstructuring in the
semiconductor industry and related markets. In close cooperation with
research institutes and industry partners SUSS MicroTec contributes to the
advancement of next-generation technologies such as 3D Integration and
nanoimprint lithography as well as key processes for MEMS and LED
manufacturing. With a global infrastructure for applications and service
SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS
MicroTec is headquartered in Garching near Munich, Germany. For more
information, please visit http://www.suss.com
Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke(at)suss.com
End of Media Release
---------------------------------------------------------------------
Issuer: SÜSS MicroTec AG
Key word(s): Products/Innovation
17.04.2013 Dissemination of a Press Release, transmitted by DGAP - a
company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.
DGAP's Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
Media archive at www.dgap-medientreff.de and www.dgap.de
---------------------------------------------------------------------
Language: English
Company: SÜSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: ir(at)suss.com
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Indices: TecDAX
Listed: Regulierter Markt in Frankfurt (Prime Standard);
Freiverkehr in Berlin, Düsseldorf, Hamburg, München,
Stuttgart
End of News DGAP-Media
---------------------------------------------------------------------
207414 17.04.2013
Themen in dieser Pressemitteilung:
environment-friendly-laser-processing-in-advanced-packaging-gains-pace
leading-us
american-idm-places-order-for-excimer-laser-ablation-tool
Unternehmensinformation / Kurzprofil:
Datum: 17.04.2013 - 14:15 Uhr
Sprache: Deutsch
News-ID 249917
Anzahl Zeichen: 5395
contact information:
Kategorie:
Business News
Diese Pressemitteilung wurde bisher 309 mal aufgerufen.
Die Pressemitteilung mit dem Titel:
"Environment friendly Laser Processing in Advanced Packaging gains Pace - Leading US-American IDM places Order for Excimer Laser Ablation Tool"
steht unter der journalistisch-redaktionellen Verantwortung von
SÜSS MicroTec AG (Nachricht senden)
Beachten Sie bitte die weiteren Informationen zum Haftungsauschluß (gemäß TMG - TeleMedianGesetz) und dem Datenschutz (gemäß der DSGVO).
