Witte manufactures vacuum chucks for checking wafers

Witte manufactures vacuum chucks for checking wafers

ID: 26574

Damage-free wafer positioning on vacuum chucks


(PresseBox) - Electronic devices are getting smaller and smaller, whilst their functions become more extensive. This creates high demands on manufacturing technology in the semiconductor industry, which carries on the trend through complex thinning techniques. However, for extremely thinned down wafers special handling technology is required to avoid damages or breakage.
For several years Witte Bleckede, manufacturer of various vacuum clamping systems, has developed concepts, designed and manufactured so-called ?wafer chucks ?for the semiconductor industry. Damage-free wafer positioning on vacuum chucks is the positive result. The clamping surface consists of a micro-porous material (also suitable for clean room class 10); the microstructure allows very thin materials to be fixed absolutely flat and damage-free. Evenness and plan parallelism of <5µm is achievable. Removable stop pins simplify positioning of wafers in the correct clamping area. With this system, contrary to many other vacuum systems, it is not necessary to cover unused areas.
After checking the wafers are gently raised using lifting pins, operated with compressed air and with integrated stop action, and are removed using an end-deffector.

Electronic devices are getting smaller and smaller, whilst their functions become more extensive. This creates high demands on manufacturing technology in the semiconductor industry, which carries on the trend through complex thinning techniques. However, for extremely thinned down wafers special handling technology is required to avoid damages or breakage.
For several years Witte Far East Pte Ltd (Singapore), manufacturer of various vacuum clamping systems, has developed concepts, designed and manufactured so-called ?wafer chucks ?for the semiconductor industry. Damage-free wafer positioning on vacuum chucks is the positive result. The clamping surface consists of a micro-porous material (also suitable for clean room class 10); the microstructure allows very thin materials to be fixed absolutely flat and damage-free. Evenness and plan parallelism of <5µm is achievable. Removable stop pins simplify positioning of wafers in the correct clamping area. With this system, contrary to many other vacuum systems, it is not necessary to cover unused areas.




After checking the wafers are gently raised using lifting pins, operated with compressed air and with integrated stop action, and are removed using an end-deffector.

Unternehmensinformation / Kurzprofil:

Electronic devices are getting smaller and smaller, whilst their functions become more extensive. This creates high demands on manufacturing technology in the semiconductor industry, which carries on the trend through complex thinning techniques. However, for extremely thinned down wafers special handling technology is required to avoid damages or breakage.
For several years Witte Far East Pte Ltd (Singapore), manufacturer of various vacuum clamping systems, has developed concepts, designed and manufactured so-called ?wafer chucks ?for the semiconductor industry. Damage-free wafer positioning on vacuum chucks is the positive result. The clamping surface consists of a micro-porous material (also suitable for clean room class 10); the microstructure allows very thin materials to be fixed absolutely flat and damage-free. Evenness and plan parallelism of <5µm is achievable. Removable stop pins simplify positioning of wafers in the correct clamping area. With this system, contrary to many other vacuum systems, it is not necessary to cover unused areas.
After checking the wafers are gently raised using lifting pins, operated with compressed air and with integrated stop action, and are removed using an end-deffector.



drucken  als PDF  an Freund senden  State-of-the-art engine technology with KUKA Systems Allweiler Delivers Chemical Pumps Worth EUR1.7 Million to Chinese Customer
Bereitgestellt von Benutzer: PresseBox
Datum: 24.11.2010 - 08:40 Uhr
Sprache: Deutsch
News-ID 26574
Anzahl Zeichen: 0

contact information:
Town:

Bleckede



Kategorie:

Tradeshows



Diese Pressemitteilung wurde bisher 327 mal aufgerufen.


Die Pressemitteilung mit dem Titel:
"Witte manufactures vacuum chucks for checking wafers"
steht unter der journalistisch-redaktionellen Verantwortung von

Horst Witte Gerätebau Barskamp KG (Nachricht senden)

Beachten Sie bitte die weiteren Informationen zum Haftungsauschluß (gemäß TMG - TeleMedianGesetz) und dem Datenschutz (gemäß der DSGVO).


Alle Meldungen von Horst Witte Gerätebau Barskamp KG



 

Werbung



Facebook

Sponsoren

foodir.org The food directory für Deutschland
Informationen für Feinsnacker finden Sie hier.

Firmenverzeichniss

Firmen die firmenpresse für ihre Pressearbeit erfolgreich nutzen
1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z