ERS electronic GmbH launches global competence center for advanced wafer level packaging
ERS electronic GmbH launches global competence center for advanced wafer level packaging(firmenpresse) - MUNICH - March 10, 2011 - ERS electronic GmbH today announced to open a new competence center by the end of March at its headquarters near Munich, Germany. There, global customers in the semiconductor manufacturing business find support for their projects in the field of advanced embedded wafer-level packaging (eWLB and similar technologies).
With its competence based on 40 years of experience in designing and manufacturing semiconductor production tools, ERS is a worldwide leader in the field of thermal technologies in the semiconductor industry. For more than six years, ERS is committed to eWLB packaging technology through the development of innovative production tools for this promising technology.
Being a fan-out manufacturing technology, eWLB offers a number of decisive advantages over traditional wafer-level packaging technologies. While in conventional WLP the number of chip contacts is limited by the die area, this is not the case in eWLB. In contrast, the technology allows chip manufacturers to implement a virtually unlimited number of external connections and thus provide the extremely complex chips required for tomorrow"s markets.
Against the background of growing substrate sizes throughout the semiconductor industry, the ability of stringent warpage control for the re-constituted wafers is indispensable to achieve high production yields. The procedure of separating the substrate from the temporary carrier in fan-out WLP is a key step in the eWLB manufacturing process. Both aspects are core competencies of ERS, covered by patent-pending technology.
In its new competence center, the company offers customers access to its latest eWLB development tools , flexible and highly innovative to cover the predicted tendency for ever larger re-constituted wafer and panels, enabling them to design and test their own eWLB-related projects and thus securing their market success.
"Thanks to our good contacts, ERS already participated in the development of eWLB technology. This know-how allows us now to take that step and Munich will not be the last Competence Center of its kind," says Klemens Reitinger, Managing Director of ERS electronic GmbH.
For further information visit: www.ers-gmbh.de
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ERS electronic GmbH, located near Munich,is in its 40th year of supplying the most innovative thermal test solutions to the semiconductor industry. The most famous products are its fast-ramping and precise low-noise thermal chuck systems (-65°C to +500°C) for analytical, parametric and wafer sort probing up to 300mm.ERS also designs and builds stand-alone thermal-forcing systems and custom production tools for special applications. ERS invented the AirCool, AirCoolplus and PowerSense thermal chuck systems that have been fully integrated into all major manual, semi- and full automatic wafer probers.
Brand+Image
Timothy K. Göbel
Kaagangerstr. 36
82279
Eching a.A.
ers(at)brandandimage.de
+49 8143 9926834
http://www.brandandimage.de
Datum: 10.03.2011 - 11:40 Uhr
Sprache: Deutsch
News-ID 28528
Anzahl Zeichen: 0
contact information:
Contact person: Klemens Reitinger
Town:
Germering
Phone: +49-89-8941320
Kategorie:
Hazadous Materials Management
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