ERS electronic welcomes Yang Shu as Senior Service Engineer for Greater China region
(PresseBox) - ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is pleased to announce that Yang Shu is joining the company as Senior Service Engineer with focus on Greater China. Mr. Shu has more than 15 years of equipment engineering experience from working for industry leaders like Accretech and Western Digital, where he has accumulated an impressive knowledge of most major wafer probing stations.
?We are thrilled to welcome Yang to our service team,? says Joshua Zhou, Sales and Marketing Director of ERS Greater China, ?As our customer base in China is growing, we need to scale our service and support team. Yang, with a proven record of customer intimacy and superb technical know-how, will play a key role in the rapid development of ERS Greater China.?
?I am excited to join the growing ERS family, a reputable and dynamic company built on a long history of innovation. I?m looking forward to working with the experienced service team at ERS, expanding and supporting our Chinese customer base,? says Yang Shu.
ERS electronic GmbH, based around Munich, has been producing innovative thermal test solutions for the industry for nearly 50 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS such as AC3, AirCool® PRIME, AirCool® and PowerSense® are integral components in all larger-sized wafer probers across the semiconductor industry.
Unternehmensinformation / Kurzprofil:
ERS electronic GmbH, based around Munich, has been producing innovative thermal test solutions for the industry for nearly 50 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS such as AC3, AirCool® PRIME, AirCool® and PowerSense® are integral components in all larger-sized wafer probers across the semiconductor industry.
Datum: 28.01.2021 - 02:30 Uhr
Sprache: Deutsch
News-ID 628580
Anzahl Zeichen: 1722
contact information:
Town:
D-82110 Munich
Kategorie:
Research & Development
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