STMicroelectronics Drives Advances in Integrated Passives and Protection Devices
(Thomson Reuters ONE) -
Next-generation integrated devices for matching, filtering and protection help
shrink circuit size and boost end-product performance
Geneva, September 24, 2013 - STMicroelectronics (NYSE: STM), a global
semiconductor leader serving customers across the spectrum of electronics
applications and the innovator of integrated micro-package components used by
OEMs to build incredibly small and highly featured products, is revealing new
families of these dimension-shrinking devices to further extend its lead in
ultra-miniature filtering, protection and RF matching devices.
ST leverages advanced semiconductor technologies to integrate commonly used
circuit elements such as passive filters, ESD suppressors and wireless baluns in
a much smaller size than state-of-the-art discrete solutions. As semiconductor
devices, ST's components also display tighter tolerances and higher stability
than conventional discrete components, allowing product designers to miniaturize
pc-board size, accelerate time-to-market and improve quality.
The latest advanced devices joining ST's micro-package families include the
world's smallest single-line Transient-Voltage Suppressor, the ESDAVLC6-1BV2, in
a 01005 surface-mount package to protect sensitive circuitry against hazardous
voltage surges. ST is also introducing the first five members of its new
ECMF(TM) family of common-mode filters embedding ESD protection. These are built
using advanced silicon technology and are offered in ultra-thin packages only
0.55mm high.
Another new member of ST's IPD (Integrated Passive Device) family, the BAL-
NRF01D3 ultra-miniature wireless balun, has already enabled ST's customers to
boost the performance of their low-power wireless solutions and save up to 90%
of the pc-board space occupied by discrete antenna-matching and harmonic-
filtering components.
Background to ST's Integrated Passives and Protection Devices
ST's technologies leverage advanced component-fabrication technologies to
combine into a single device multiple circuit elements including resistors,
capacitors, inductors and ESD diodes that are otherwise typically implemented as
individual components on the pc-board. In this way, ST's integrated devices
eliminate multiple components and the interconnections between them, resulting
in a large net saving in pc-board area. Hence designers can use them to create
smaller end-products, increase functionality by designing-in extra ICs, simplify
PCB layout and shorten time-to-market for new products.
Moreover, ST's integrated devices deliver better performance than equivalent
discrete devices, as they are produced using semiconductor processes that
display greater quality, reliability and process control. Component values have
closer tolerances and reduced variation over time compared with conventional
devices such as Metal-Oxide Varistors (MOVs), Low-Temperature Co-fired Ceramic
(LTCC) devices and general-purpose passive components. These advantages allow
customers to improve the quality of their products and the perception of their
brand.
The BAL-NRF01D3 is in mass production in a 5-bump flip-chip package, priced
from $0.18 for orders over 5,000 units. The ECMF common-mode filters are also
in mass production, priced from $0.16 (ECMF02-2BF3) for orders over 1,000 units.
The ESDAVLC6-1BV2 Transient-Voltage Suppressor is priced from $0.10 for orders
over 1,000 units.
For further information on ST's ECMF devices please go to http://www.st.com/ecmf
or http://www.st.com/common_mode_filters
For further information on ST's EMI filtering and signal conditioning devices
please go to http://www.st.com/ipad
For further information on ST's IPD devices for RF front-end please go to
http://www.st.com/ipd
About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and office,
at work and at play, ST is found everywhere microelectronics make a positive and
innovative contribution to people's life. By getting more from technology to get
more from life, ST stands for life.augmented.
In 2012, the Company's net revenues were $8.49 billion. Further information on
ST can be found at www.st.com.
For Press Information Contact:
STMicroelectronics
Michael Markowitz
Director Technical Media Relations
+1 781 591 0354
michael.markowitz(at)st.com
STMicroelectronics Advances in Integrated Passives_IMAGE:
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STMicroelectronics Advances in Integrated Passives:
http://hugin.info/152740/R/1731114/578708.pdf
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Source: STMicroelectronics via Thomson Reuters ONE
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Unternehmensinformation / Kurzprofil:
Datum: 24.09.2013 - 15:00 Uhr
Sprache: Deutsch
News-ID 299676
Anzahl Zeichen: 5896
contact information:
Town:
Geneva
Kategorie:
Business News
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