SUSS MicroTec Installs ELP300 Excimer Laser Stepper at Fraunhofer IZM Berlin
(firmenpresse) - (DGAP-Media / 20.11.2013 / 16:56)
PRESS RELEASE
SUSS MicroTec Installs ELP300 Excimer Laser Stepper at Fraunhofer IZM
Berlin
Garching, November 20, 2013 - SUSS MicroTec, a global supplier of equipment
and process solutions for the semiconductor industry and related markets,
has successfully installed an ELP300 excimer laser stepper to support next
generation advanced packaging and 3D IC laser debonding applications at the
Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.
The ELP300 excimer laser platform is designed for high volume manufacturing
and processing of 100mm to 300mm wafers. The platform provides two novel
manufacturing technologies to Fraunhofer IZM used in advanced packaging and
3D applications: 1) Excimer ablation provides the means to directly create
vias and microstructures to combat technical limitations of traditional
photo-dielectrics and photolithography approaches and 2) laser debonding of
3D IC's and MEMS for a stress free, non-thermal and very cost efficient
method to debond thin wafers off a carrier. The Excimer laser stepper
enables the development of higher performance packages in the manufacturing
of next generation semiconductor devices, but also provides a significant
cost savings potential.
As part of the Fraunhofer-Gesellschaft, Fraunhofer IZM specializes in
applied and industrial contract research. Fraunhofer IZM's focus is on
electronic packaging technology and the integration of multifunctional
electronics into systems. With the new ELP laser system the Fraunhofer IZM
will broaden his expertise in the field of thinfilm polymers. These
polymers are an important building block in all wafer level packages.
Currently the need of photosensitivity has limited the application of new
polymers which are required for thinner devices and 3D stacking
applications. With laser ablation completely new polymer systems can be
used with enhanced mechanical, physical and chemical properties like lower
curing temperature, lower stress, and lower thermal coefficient of
expansion. In addition the laser system will give a much higher flexibility
for temporary wafer bonding. Ultrathin wafers can be handled safely without
damage even at processes which require temperatures above 300 C.
'The ELP 300 will revolutionize technology in wafer level packaging and
3-D integration' says Dr. Michael Toepper manager of WLP at Fraunhofer IZM.
'The need of photosensitivity for thinfilm polymers has been a strong
barrier for better mechanical properties which are essential for high
reliability of electronic systems. In addition the whole process becomes
much cheaper and also much more environmentally friendly due to less
consumption of organic solvents and TMAH.
'We see high growth potential for this technology, especially in our core
market of advanced packaging and the future growth market for 3D IC's.',
says Frank P. Averdung, President and CEO of SUSS MicroTec. 'We have a long
established relationship with the Fraunhofer IZM and we are excited to have
our new excimer laser system installed at this leading research institute.'
About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for
microstructuring in the semiconductor industry and related markets. In
close cooperation with research institutes and industry partners SUSS
MicroTec contributes to the advancement of next-generation technologies
such as3D Integration and nanoimprint lithography as well as key processes
for MEMS and LED manufacturing. With a global infrastructure for
applications and service SUSS MicroTec supports more than 8.000 installed
systems worldwide. SUSS MicroTec is headquartered in Garching near Munich,
Germany. For more information, please visit http://www.suss.com
Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke(at)suss.com
End of Media Release
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Issuer: SÜSS MicroTec AG
Key word(s): Research/Technology
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company of EQS Group AG.
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Language: English
Company: SÜSS MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Germany
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: ir(at)suss.com
Internet: www.suss.com
ISIN: DE000A1K0235
WKN: A1K023
Listed: Regulierter Markt in Frankfurt (Prime Standard);
Freiverkehr in Berlin, Düsseldorf, Hamburg, München,
Stuttgart
End of News DGAP-Media
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