DGAP-News: Süss MicroTec AG: Final Figures for 2010 Fiscal Year Published
(firmenpresse) - DGAP-News: Süss MicroTec AG / Key word(s): Final Results
Süss MicroTec AG: Final Figures for 2010 Fiscal Year Published
30.03.2011 / 08:29
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Final Figures for 2010 Fiscal Year Published
- Order Intake at EUR 189.3 million, which is 97 % above prior year
- Sales plus 34 % to EUR 139.1 million
- EBIT quintupled to EUR 14.3 million
- Net liquidity increased to EUR 34.6 million
Garching, March 30, 2011 - SUSS MicroTec AG published its consolidated
financial statements for the 2010 fiscal year today. The figures show that
the company experienced a clear increase in both sales and order entry in
the past fiscal year. Excluding the discontinued Test Systems division and
including HamaTech APE, consolidated since March 2010, the SUSS MicroTec
Group generated sales of EUR 139.1 million, beating the previous year's
level of EUR 103.9 million by approximately 34%. Order entry increased
significantly by 97% year on year to EUR 189.3 million (previous year: EUR
96.3 million).
The group's core division - Lithography - posted a 15% increase in sales to
EUR 88.9 million (previous year: EUR 77.6 million) during the year under
review. The Substrate Bonder division also succeeded in growing its
revenues by approximately 35% to EUR 24.7 million (previous year: EUR 18.3
million). The upswing in Lithography was largely due to the end of the
general reluctance to make new investments as well as the increased demand
from Asian production customers. The Substrate Bonder division benefited
from the increasing importance of bonding equipment in the manufacturing
process of MEMS, LED and future three-dimensional chip structures (3D
integration). The Photomask Equipment division, acquired in early 2010,
already contributed sales of EUR 18.4 million.
Due to the sharp increase in sales, coupled with only moderate cost
increases, the company was able to generate earnings before interest and
tax (EBIT) of EUR 14.3 million for the last fiscal year, meaning a
quintuplication from the previous years' level of EUR 2.8 million. This
translates into an EBIT-margin of 10.3%. The largest EBIT contribution came
again from the Lithography division, but the new Photomask Equipment
division also contributed positively to the EBIT. Only the division
Substrate Bonder, burdened with restructuring expenses as well as
strategically important orders with low margins, shows a negative result
for 2010.
Earnings after taxes (EAT) from continuing operations amounted to EUR 13.0
million, compared to EUR 0.5 million in the previous year. The basic
earnings per share (EPS), therefore, totaled EUR 0.71 (previous year: EUR
0.03).
Liquidity
Cash and interest bearing securities amounted to EUR 50.1 million at the
end of the 2010 fiscal year. Net liquidity has increased significantly by
the end of 2010, amounting to EUR 34.6 million (December 31, 2009: EUR 18.4
million). The Free Cash Flow for the fiscal year, before security
transactions and extraordinary effects as well as M&A transactions, was EUR
14.1 (previous year: EUR 8.9 Million).
Outlook
After three consecutive strong quarters in fiscal year 2010, the company
again anticipates a strong order entry totaling approximately EUR 45
million for the first three months of 2011. For the first half year of the
fiscal year 2011 the company expects sales of more than EUR 80million. For
the first three months of the current fiscal year sales are expected to be
below EUR 35 million. The reason for this rather low sales figure is the
current restructuring and relocation activity at the Sternenfels site,
which lead to operational shortcomings in the first quarter. Additionally
the company, as well as other companies, is currently faced with increased
lead times from some suppliers. All in all, the Management Board expects
sales of more than EUR 170 million for the current fiscal year, 2011. The
Company also expects the EBIT-margin to improve compared with the previous
year. As of today the free cash flow is expected to reach a double digit
million Euro figure.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for
markets such as 3D-Integration, Advanced Packaging, MEMS, Nanotechnology
and Compound Semiconductor. High-quality solutions enable customers to
increase process performance while reducing cost of ownership. SUSS
MicroTec supports more than 8,000 installed mask aligners, coaters, bonders
and probe systems with a global infrastructure for applications and
service. SUSS MicroTec is headquartered in Garching near Munich, Germany.
For more information, please visit http://www.suss.com
Disclaimer:
This press release contains forward-looking statements relating to the
business, financial performance and earnings of SUSS MicroTec AG and its
subsidiaries and associates. Forward-looking statements are based on
current plans, estimates, projections and expectations and are therefore
subject to risks and uncertainties, most of which are difficult to estimate
and which in general are beyond the control of SUSS MicroTec AG.
Consequently, actual developments as well as actual earnings and
performance may differ materially from those which explicitly or implicitly
assumed in the forward-looking statements. SUSS MicroTec AG does not intend
or accept any obligation to publish updates of these forward-looking
statements
Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke(at)suss.com
End of Corporate News
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Language: English
Company: Süss MicroTec AG
Schleissheimer Strasse 90
85748 Garching
Deutschland
Phone: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
E-mail: ir(at)suss.com
Internet: www.suss.com
ISIN: DE0007226706
WKN: 722670
Listed: Regulierter Markt in Frankfurt (Prime Standard);
Freiverkehr in Berlin, Düsseldorf, Hamburg, München,
Stuttgart
End of News DGAP News-Service
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117530 30.03.2011
Datum: 30.03.2011 - 08:29 Uhr
Sprache: Deutsch
News-ID 33639
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Kategorie:
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