Technologies and Techniques for Optimizing 2.5D Designs for Power and Cost Effectiveness

Technologies and Techniques for Optimizing 2.5D Designs for Power and Cost Effectiveness

ID: 343729

eSilicon's Javier DeLaCruz to Moderate 2.5D Panel Discussion at MemCon 2014


(firmenpresse) - SAN JOSE, CA -- (Marketwired) -- 10/14/14 --

Javier DeLaCruz, senior director of engineering at , a leading independent semiconductor design and manufacturing solutions provider

Panel discussion: 2.5D ICs: How to reduce power, cost and complexity to accelerate market adoption

MemCon 2014, Santa Clara Convention Center, room ECO105

October 15, 2014, 4:50-5:35 PM

Panelists include MP Divakar, consultant; Jamie Markevitch, Cisco Systems; Bob Patti, Tezzaron and Arif Rahman, Altera Corp.

eSilicon, a leading independent semiconductor design and manufacturing solutions provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk, automated path to volume production. eSilicon serves a wide variety of markets including communications, computer, consumer, industrial products and medical.

eSilicon -- Enabling Your Silicon Success™

eSilicon is a registered trademark, and the eSilicon logo and Enabling Your Silicon Success are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.



Contacts:
Sally Slemons
eSilicon Corporation
408.635.6409


Susan Cain
Cain Communications
408.393.4794



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Bereitgestellt von Benutzer: Marketwired
Datum: 14.10.2014 - 12:00 Uhr
Sprache: Deutsch
News-ID 343729
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SAN JOSE, CA



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Electronic Components



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