WiLAN Settles Semiconductor Packaging Related Litigation
(firmenpresse) - OTTAWA, CANADA -- (Marketwired) -- 05/01/15 -- WiLAN (TSX: WIN)(NASDAQ: WILN) today announced that the company's wholly-owned subsidiary, Collabo Innovations Inc., has entered into a settlement and license agreement that resolves pending litigation in the United States District Court for the District of Delaware related to semiconductor packaging technology.
The consideration to be paid to WiLAN as well as all other terms of the agreement are confidential.
About WiLAN
WiLAN is one of the most successful patent licensing companies in the world and helps companies unlock the value of intellectual property by managing and licensing their patent portfolios. The Company operates in a variety of markets including automotive, digital television, Internet, medical, semiconductor and wireless communication technologies. WiLAN's wholly-owned subsidiary, WiLAN Labs, develops and commercializes innovative solutions to the challenges facing next generation communication networks. Founded in 1992, WiLAN is listed on the TSX and NASDAQ and is included in the S&P/TSX Dividend and Dividend Aristocrats Indexes. For more information: .
Forward-looking Information
This news release contains forward-looking statements and forward-looking information within the meaning of the U.S. Private Securities Litigation Reform Act of 1995 and other United States and Canadian securities laws. The phrases "The consideration to be paid to WiLAN" and similar terms and phrases are intended to identify these forward-looking statements. Forward-looking statements and forward-looking information are based on estimates and assumptions made by WiLAN in light of its experience and its perception of historical trends, current conditions, expected future developments and the expected effects of new business strategies, as well as other factors that WiLAN believes are appropriate in the circumstances. Many factors could cause WiLAN's actual performance or achievements to differ materially from those expressed or implied by the forward-looking statements or forward-looking information. Such factors include, without limitation, the risks described in WiLAN's February 2, 2015 annual information form for the year ended December 31, 2014 (the "AIF"). Copies of the AIF may be obtained at or . WiLAN recommends that readers review and consider all of these risk factors and notes that readers should not place undue reliance on any of WiLAN's forward-looking statements. WiLAN has no intention and undertakes no obligation to update or revise any forward-looking statements or forward-looking information, whether as a result of new information, future events or otherwise, except as required by law.
All trademarks and brands mentioned in this release are the property of their respective owners.
Contacts:
For media and investor inquiries, please contact:
Tyler Burns
Director, Investor Relations
O: 613.688.4330
C: 613.697.0367
Themen in dieser Pressemitteilung:
Unternehmensinformation / Kurzprofil:
Datum: 01.05.2015 - 14:30 Uhr
Sprache: Deutsch
News-ID 390208
Anzahl Zeichen: 0
contact information:
Town:
OTTAWA, CANADA
Kategorie:
Networking
Diese Pressemitteilung wurde bisher 186 mal aufgerufen.
Die Pressemitteilung mit dem Titel:
"WiLAN Settles Semiconductor Packaging Related Litigation"
steht unter der journalistisch-redaktionellen Verantwortung von
WiLAN (Nachricht senden)
Beachten Sie bitte die weiteren Informationen zum Haftungsauschluß (gemäß TMG - TeleMedianGesetz) und dem Datenschutz (gemäß der DSGVO).
