ST Unveils its DOCSIS 3.1 Chipset Solution, Opening Multi-Gigabit Era to Cable MSOs
(Thomson Reuters ONE) -
Cost-effective, no-compromise performance, using innovative and future-proof
architecture, prepared for first DOCSIS® 3.1 market deployments
Geneva, August 4, 2015 - STMicroelectronics (NYSE: STM), a global semiconductor
leader serving customers across the spectrum of electronics applications, today
announced the STiD325 (codenamed Barcelona), its DOCSIS[1] 3.1 chipset for
Broadband CPE[2] Cable Modems, embedded Media Terminal Adapters (eMTAs), and
Gateways, as well as for Video Gateways when associated to set-top-box chipsets.
It is being demonstrated at CableLabs Summer Conference, August 2-5, 2015 in
Keystone, Colorado, USA.
DOCSIS 3.1 has been engineered by CableLabs® to unleash the multi-gigabit data
era on existing Hybrid Fiber-Coax (HFC) networks through improved spectral
efficiency using OFDM[3] multi-carrier modulation combined with low-density
parity-check-based Forward Error Correction.
"Prepared to be among the first commercial DOCSIS 3.1 deployments, our
innovative platform architecture supports our ambition to make Barcelona a
reference in the Cable industry," said Philippe Notton, Group Vice President and
General Manager of STMicroelectronics' Consumer Product Division. "As a
standalone for multi-gigabit cable gateways or combined with our Monaco SoC for
an UltraHD media gateway, ST can offer complete solutions for fast design."
Barcelona is fully compliant with the DOCSIS 3.1 specification, including:
* Two 196 MHz OFDM downstream channels;
* 32 single-carrier DOCSIS 3.0 QAM[4] downstream channels;
* Two 96 MHz OFDM-A upstream channels;
* 8 single-carrier DOCSIS 3.0 QAM upstream channels.
ST has a long history with DOCSIS technology, having contributed to the
standards and participated in all Acceptance Test Plan development committees
and Interoperability tests. Demonstrating the value of that effort, the
Barcelona early platform operated successfully in the world's first end-to-end
DOCSIS 3.1 field test conducted earlier this year.
Designed for economy and performance, Barcelona features solid technical
capabilities:
* Very high performance using multiple 64-bit ARM(®) CPUs to deliver >10K
DMIPS, line-rate networking support on every port, and hardware acceleration
for routing and switching, allowing Multiple System Operators (MSOs) to
build future-proof CPE platforms with plenty of headroom to support the
field introduction of new services;
* Backward compatibility with DOCSIS 3.0 32x8 to allow a smooth, cost-
effective transition to DOCSIS 3.1;
* Flexible architecture facilitating independent software development and
software upgrades with minimal coupling between stacks, as well as the
introduction of new features like home surveillance and home automation;
support of various Wi-Fi configurations;
* 28nm FD-SOI silicon technology, providing outstanding power efficiency at
all operating levels, including fan-less designs, along with highly-
efficient RF and analog integration.
Currently sampling to lead customers, Barcelona comes with pre-integrated RDK-B
software, including DOCSIS and Packet-Cable stacks.
To learn more about the STiD325 chipset, please contact ST sales.
About STMicroelectronics
ST is a global leader in the semiconductor market serving customers across the
spectrum of sense and power and automotive products and embedded processing
solutions. From energy management and savings to trust and data security, from
healthcare and wellness to smart consumer devices, in the home, car and office,
at work and at play, ST is found everywhere microelectronics make a positive and
innovative contribution to people's life. By getting more from technology to get
more from life, ST stands for life.augmented.
In 2014, the Company's net revenues were $7.40 billion. Further information on
ST can be found at www.st.com.
For Press Information Contact:
STMicroelectronics
Michael Markowitz
Director Technical Media Relations
+1 781 591 0354
michael.markowitz(at)st.com
--------------------------------------------------------------------------------
[1] Data Over Cable Service Interface Specification
[2] Customer Premises Equipment includes the set-top boxes, routers, and
gateways that operate at the customer's locations.
[3] Orthogonal Frequency Division Multiplexing is a method of encoding digital
data on multiple carrier frequencies.
[4] Quadrature Amplitude Modulation is a method for encoding digital data in an
analog signal in which each combination of phase and amplitude represents one of
sixteen 4-bit patterns.
STMicro DOCSIS 3.1 Chipset:
http://hugin.info/152740/R/1943514/703780.pdf
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Source: STMicroelectronics via GlobeNewswire
[HUG#1943514]
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Datum: 04.08.2015 - 15:00 Uhr
Sprache: Deutsch
News-ID 411353
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contact information:
Town:
Geneva
Kategorie:
Business News
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