STMicroelectronics Reveals New Chipset Family for HD HEVC Entry Set-Top Boxes
(Thomson Reuters ONE) -
Full-featured, cost-optimized ARM®-based solutions for broadcast and connected
HD HEVC STBs deliver future-proof performance and interfaces
Geneva, September 9, 2015 - STMicroelectronics (NYSE: STM), a global
semiconductor leader serving customers across the spectrum of electronics
applications, today announced its new HD HEVC Liege3 family of chipsets for
entry Set-Top-Box markets, composed of satellite variants (STiH337/STiH332),
cable-market products (STiH372), and IPTV set-top-box devices (STiH307/STiH302).
More than just an upgrade of previous-generation devices, the new chipset family
combines the latest architectures used in ST's Cannes (STiH310/STiH312/318)
products with optimized IPs to deliver future-proof SoCs with high integration.
This will enable large-scale migration of entry set-top boxes towards HEVC (High
Efficiency Video Coding).
ST's new set-top-box devices benefit from a scalable hardware and software
architecture enabling flexible platform configurations to reach optimized
price/user experience ratio across the different HD HEVC entry set-top-box
segments. All chipsets in the new ARM-based family are pin-to-pin compatible to
facilitate design re-use among the different broadcast technologies. Software
compatibility with ST's Cannes SoC family enables OEMs to benefit from the
comprehensive ecosystem in order to easily design innovative client boxes on
multiple middleware products.
Addressing the satellite markets, the STiH337/STiH332 SoCs implement a new DVB-
S2X demodulation scheme enabling MSOs (Multiple System Operators) to leverage
compression-efficiency improvements brought by the HEVC technology. This results
in the enhancement of S2X spectral efficiency for optimal use of the satellite
transponder capacity.
"Our new ARM-based chipset family strengthens ST's presence in all the segments
of the very dynamic HD HEVC entry set-top-box broadcast markets. It also
underlines our strong engagement and capacity to deliver innovative solutions,"
said Philippe Notton, Group Vice President and General Manager of
STMicroelectronics' Consumer Product Division. "With the new Liege3 SoC family,
MSOs can maximize the lifetime of their HEVC investments with a chipset platform
that integrates enough processing power for future evolution while today
supporting all the latest key interfaces and broadcast technologies for optimal
spectrum usage."
Key features of ST's new set-top-box SoC family that ranges from entry-level
2.5 K DMIPS without GPU up to 5K DMIPS with embedded GPU include:
* ARM(®) CPU capable of delivering up to 5K DMIPS for advanced user interface
and complex middleware;
* Mali(TM) 400 GPU for fluid user interface and HTML5 support on connected
platforms;
* HEVC 10-bit performance proven by extensive interoperability tests performed
with all major encoder providers;
* A rich set of future-proof connectivity options including Ethernet, USB 3,
PCIe, HDMI;
* Integrated DVB-C or DVB-S2X demodulator;
* HDR support;
* Advanced security engine enabling CAS- and DRM-based secure video- content
protection;
* 28nm FD-SOI (Fully Depleted Silicon on Insulator) technology, providing
highly-efficient RF and analog integration as well as outstanding power
efficiency at all operating levels, enabling very small fan-less designs.
Reinforcing ST's commitment to serve the HD entry-level set-top-box markets, the
new Liege3 SoC family is currently sampling to lead customers and will be
demonstrated in ST's private demo suite at IBC 2015.
About STMicroelectronics
ST is a global semiconductor leader delivering intelligent and energy-efficient
products and solutions that power the electronics at the heart of everyday life.
ST's products are found everywhere today, and together with our customers, we
are enabling smarter driving and smarter factories, cities and homes, along with
the next generation of mobile and Internet of Things devices. By getting more
from technology to get more from life, ST stands for life.augmented.
In 2014, the Company's net revenues were $7.40 billion, serving more than
100,000 customers worldwide. Further information can be found at www.st.com.
For Press Information Contact:
STMicroelectronics
Michael Markowitz
Director Technical Media Relations
+1 781 591 0354
michael.markowitz(at)st.com
New STB SoCs from STMicro:
http://hugin.info/152740/R/1950741/709328.docx
This announcement is distributed by GlobeNewswire on behalf of
GlobeNewswire clients. The owner of this announcement warrants that:
(i) the releases contained herein are protected by copyright and
other applicable laws; and
(ii) they are solely responsible for the content, accuracy and
originality of the information contained therein.
Source: STMicroelectronics via GlobeNewswire
[HUG#1950741]
Unternehmensinformation / Kurzprofil:
Datum: 09.09.2015 - 15:00 Uhr
Sprache: Deutsch
News-ID 418914
Anzahl Zeichen: 5529
contact information:
Town:
Geneva
Kategorie:
Business News
Diese Pressemitteilung wurde bisher 267 mal aufgerufen.
Die Pressemitteilung mit dem Titel:
"STMicroelectronics Reveals New Chipset Family for HD HEVC Entry Set-Top Boxes"
steht unter der journalistisch-redaktionellen Verantwortung von
STMicroelectronics (Nachricht senden)
Beachten Sie bitte die weiteren Informationen zum Haftungsauschluß (gemäß TMG - TeleMedianGesetz) und dem Datenschutz (gemäß der DSGVO).
