Micron Introduces Mobile 3D NAND Solution for Next-Generation Smartphones
(Thomson Reuters ONE) -
New Micron Mobile 32GB 3D NAND memory technology delivers better quality,
performance and reliability for next-generation mobile multimedia and streaming
experiences
SANTA CLARA, Calif., Aug. 09, 2016 (GLOBE NEWSWIRE) -- Micron Technology, Inc.,
(Nasdaq:MU) today introduced the company's first 3D NAND memory technology
optimized for mobile devices and its first products based on the Universal Flash
Storage (UFS) 2.1 standard. Micron's initial mobile 3D NAND-based 32GB solution
is targeted specifically for the high and mid-end smartphone segments which make
up approximately 50 percent of worldwide smartphone volume([)(1]). As mobile
devices bypass personal computers as consumers' primary computing device, user
behaviors heavily impact the device's mobile memory and storage requirements.
Micron's mobile 3D NAND addresses these concerns, enabling an unparalleled user
experience that includes seamless high definition video streaming, higher
bandwidth gameplay, faster boot up times, camera performance and file loading.
"Micron continues to advance NAND technology with our introduction of 3D NAND
and UFS products for the mobile segment," said Mike Rayfield, vice president of
Micron's mobile business unit. "The improved performance, higher capacity and
enhanced reliability of 3D NAND will help our customers meet the ever-growing
demand for mobile storage and will enable much more exciting end user
experiences."
To meet the elevated hardware demands stemming from increased mobile video and
multimedia consumption, as well as the anticipated increased storage demands
that will result from the introduction of 5G wireless networks, Micron 3D NAND
technology stacks layers of data storage cells vertically with extraordinary
precision to create storage solutions with three times more capacity than
previous generation planar NAND technologies. Because capacity is achieved by
stacking cells vertically, Micron is able to pack more storage cells into a much
smaller die area, resulting in the delivery of the industry's smallest 3D NAND
memory die measuring only 60.217mm(2). A smaller die enables a tiny memory
packaging footprint which can free up space for additional mobile battery size
or enable smaller form factor devices.
"3D NAND technology will be vital to the continued development of smartphones
and other mobile devices," said Greg Wong, founder and principal analyst at
Forward Insights. "With the advent of 5G and mobile's increasing influence in
our digital lives, smartphone makers are in need of the most advanced technology
to store and manage the ever-increasing volume of data. Micron's 3D NAND for
mobile is well suited to address the market's evolving data storage needs by
enabling a more seamless user experience for high resolution video, gaming, and
photography."
3D NAND: Powering the Changing Mobile Landscape
Micron's first 3D NAND for mobile offers several competitive technical
advantages. New features include:
* Industry's first mobile product built on floating gate technology, a
universally utilized design refined through years of high-volume planar
flash manufacturing
* Micron's first memory devices with UFS 2.1 standard, which enable best-in
class Sequential Read Performance for the mobile market
* 3D NAND-based multichip packages (MCPs) also include low power LPDDR4X,
providing up to 20 percent more energy efficiency than standard LPDDR4
memory
* Industry's smallest 3D NAND memory die, measuring only 60.217mm(2), allows
tiny memory packaging ideal for ultra-small form factor devices; Micron's
3D NAND die is up to 30% smaller than planar NAND die of the same capacity.
Micron's 3D NAND solutions for mobile are now sampling with mobile customers and
partners and will be widely available by the end of 2016.
[1] Source: Micron internal forecast
Additional Resources:
* Lean more about Micron mobile memory solutions
* Learn more about Micron's 3D NAND products
* 3D NAND for Mobile Data Sheet
Follow us online! Take part in Micron's social conversations where we're talking
all things storage and memory:
* Blog: www.micron.com/about/blogs
* Twitter: www.twitter.com/MicronTech
* LinkedIn: www.linkedin.com/company/micron-technology
* YouTube: www.youtube.com/microntechnology
Micron Technology, Inc.
Micron Technology, Inc., is a global leader in advanced semiconductor systems.
Micron's broad portfolio of high-performance memory technologies-including DRAM,
NAND and NOR Flash-is the basis for solid state drives, modules, multichip
packages and other system solutions. Backed by more than 35 years of technology
leadership, Micron's memory solutions enable the world's most innovative
computing, consumer, enterprise storage, networking, mobile, embedded and
automotive applications. Micron's common stock is traded on the NASDAQ under the
MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.
Media Contact
Sarah Lewis
Zeno Group for Micron Technology
650-801-0937
sarah.lewis(at)zenogroup.com
This announcement is distributed by GlobeNewswire on behalf of
GlobeNewswire clients. The owner of this announcement warrants that:
(i) the releases contained herein are protected by copyright and
other applicable laws; and
(ii) they are solely responsible for the content, accuracy and
originality of the information contained therein.
Source: Micron Technology, Inc. via GlobeNewswire
[HUG#2033944]
Unternehmensinformation / Kurzprofil:
Bereitgestellt von Benutzer: hugin
" alt="Pasinex Underground Drilling at Pinargozu in Turkey Intercepts Mineralized Horizon East of Mine Workings
Datum: 09.08.2016 - 14:00 Uhr
Sprache: Deutsch
News-ID 488046
Anzahl Zeichen: 6244
contact information:
Town:
Boise Idaho
Kategorie:
Business News
Diese Pressemitteilung wurde bisher 243 mal aufgerufen.
Die Pressemitteilung mit dem Titel:
"Micron Introduces Mobile 3D NAND Solution for Next-Generation Smartphones"
steht unter der journalistisch-redaktionellen Verantwortung von
Micron Technology, Inc. (Nachricht senden)
Beachten Sie bitte die weiteren Informationen zum Haftungsauschluß (gemäß TMG - TeleMedianGesetz) und dem Datenschutz (gemäß der DSGVO).
