Applied Materials Advances Etch Technology to Lower TSV Manufacturing Cost
(Thomson Reuters ONE) -
* TSV market accelerating to enable higher performance mobile devices
* New, enhanced Silvia etch system breaks a key cost barrier to widespread TSV
adoption
TOKYO, Japan, November 30, 2010 - Applied Materials, Inc. today revealed its
latest innovations in through-silicon via (TSV) etch technology on its Applied
Centura® Silvia(TM) Etch system. A new plasma source boosts the silicon etch
rate by over 40% to rapidly create high aspect ratio via structures with smooth,
vertical profiles. This benchmark performance enables the Silvia system to bring
the cost for via etch below $10 per wafer for the first time, helping chipmakers
bring to market the advanced 3D-IC[1] designs that will power future high-
performance mobile devices.
"The new Silvia system is an example of Applied's focus on developing
technology to bring down the cost of TSV fabrication - which has been a
significant barrier to the widespread implementation of this important
technology," said Ellie Yieh, vice president and general manager of Applied
Material's Etch Business Unit. "The Silvia system's unmatched performance has
been enthusiastically received by our customers and will help them bring TSV
technology to high-volume manufacturing."
A new ultra-high-density plasma source increases the Silvia system's silicon
etch rate by over 40% while maintaining the system's trademark precise profile
control and virtually scallop-free sidewalls - which are critical to the
subsequent deposition of high-quality liner and fill films. In addition, the
remarkable speed and precision of the Silvia system makes it ideal for other
cost-sensitive 3D-IC packaging applications such as "via reveal etch" that
require rapid, highly uniform removal of bulk silicon from the back side of the
wafer.
According to market researcherGartner Dataquest, Applied Materials is ranked
number one in both the TSV etch and wafer-level packaging markets based on
worldwide revenue from system shipments in 2009[2]. Applied has the only
complete toolset for all TSV manufacturing flows, covering Etch, CVD[3], PVD[4],
ECD[5], wafer surface preparation and CMP[6]. With its unique ability to
validate complete process flows at the company's Maydan Technology Center,
Applied can mitigate risk and accelerate learning for its customers, assuring a
smooth transition from R&D to volume production. For more information, visit
www.appliedmaterials.com/tsv.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. At Applied Materials, we turn today's innovations into the industries of
tomorrow. Learn more atwww.appliedmaterials.com.
[1] 3D-IC = three-dimensional integrated circuit
[2] "Market Share: Semiconductor Equipment, Worldwide, 2009" Gartner, Inc.
Barbara Van et al., April 5, 2010
[3] CVD = chemical vapor deposition
[4] PVD = physical vapor deposition
[5] ECD = electrochemical deposition
[6] CMP = chemical-mechanical planarization
Contact:
Betty Newboe (editorial/media) 408.563.0647
Michael Sullivan (financial community) 408.986.7977
[HUG#1466760]
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Source: Applied Materials via Thomson Reuters ONE
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Datum: 29.11.2010 - 23:01 Uhr
Sprache: Deutsch
News-ID 49215
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