Applied Materials Speeds Chip Interconnects with High-Performance, Power-Efficient, Low-k Technology
(Thomson Reuters ONE) -
* Mobility era demands lower power, faster microprocessor and graphics chips
* Nearly one-third of microprocessor power is consumed by the interconnects
* Challenge: Providing a low resistance, mechanically strong, dielectric film
for high chip yield
* Solution: Applied's third-generation ultra-low-k film and UV curing
technologies
SANTA CLARA, Calif., July 12, 2011 - Applied Materials, Inc. today introduced
its latest technology for building fast, low power interconnects in logic
devices at the 22nm node and below with the Applied Producer(®) Black
Diamond(TM) 3 deposition system and Applied Producer(®) Nanocure(TM) 3 UV curing
system. Together, these systems create the critical low-k dielectric films that
insulate miles of copper wiring that connect a chip's transistors to each other
and to the outside world enabling higher speed, more power-efficient
smartphones, tablets and PCs.
"Our new Black Diamond 3 technology is extendible to the 14nm design node and
below and will enable the fabrication of the next several generations of
smaller, higher performance and more power-efficient devices," said Bill
McClintock, vice president and general manager of Applied's Dielectric Systems
and Modules business unit. "Our customers are very excited about this new low-k
solution since it can be smoothly integrated into their existing process flows
and has the superior mechanical strength needed to withstand the rigorous
packaging process to enable higher device yields."
Designed at the molecular level with a proprietary chemistry, Applied's Black
Diamond 3 process creates a dielectric film with uniform porosity. This
engineered nano-porosity greatly increases the mechanical strength and hardness
of the film - enabling it to withstand the stress of hundreds of downstream
processes and packaging steps. The new film also delivers an industry-leading k-
value of 2.2, which reduces unwanted, or parasitic, capacitance in interconnects
and allows chipmakers to boost the electrical performance of their devices. A
lower k-value also helps to reduce switching power losses for optimizing battery
life and reducing heat build-up, which are critical for power-efficient mobile
devices.
The new Applied Producer Nanocure 3 system enhances Applied's industry-leading
ultraviolet (UV) curing technology for porous low-k films with advancements in
UV source optics and chamber design that provide up to 50% more uniform curing
than conventional processes. The Nanocure 3 employs a high intensity UV source
with a low pressure curing process that results in 40% faster curing. Combined
with the Black Diamond 3 film, this two-step deposition and cure process
provides up to twice the mechanical strength of Applied's successful second
generation Black Diamond film, reducing device variability and boosting chip
yield.
"Applied's Black Diamond technology was introduced for the 90nm technology node
and has remained the industry standard for low-k films for more than a decade
due to our continuous innovation in significantly improving dielectric film
strength while simultaneously reducing its k-value," said Dr. Randhir Thakur,
executive vice president and general manager of the Silicon Systems Group at
Applied Materials. "We are pleased that our interconnect solutions are helping
the industry keep pace with the relentless drive for greater power efficiency
and speed."
Applied Materials will showcase the breakthrough Black Diamond 3 and Nanocure 3
technologies at Semicon West in San Francisco from July 12-14. For more
information, visit www.appliedmaterials.com/events/semicon-west-2011.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic products. Our
technologies help make innovations like smartphones, flat screen TVs and solar
panels more affordable and accessible to consumers and businesses around the
world. At Applied Materials, we turn today's innovations into the industries of
tomorrow. Learn more at www.appliedmaterials.com.
# # #
Contact:
Connie Duncan (editorial/media) 408.563.6209
Michael Sullivan (financial community) 408.986.7977
Applied?s third-generation ultra-low-k film and UV curing technologies:
http://hugin.info/143724/R/1530244/465506.jpg
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Source: Applied Materials via Thomson Reuters ONE
[HUG#1530244]
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Datum: 12.07.2011 - 13:32 Uhr
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News-ID 56333
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