ERS AirCool3 Chuck System boosts reliability, cuts operating costs
ERS AirCool3 Chuck System boosts reliability, cuts operating costs(firmenpresse) - MUNICH - August 25, 2011 - ERS electronic GmbH, market leader in the field of Thermal Wafer Chucks, announced today its AirCool3 300mm Wafer Chuck System. The system offers very small to zero foot print for the associated chilling unit plus the capability to test power-dissipating semiconductor devices. Since it uses air instead of a liquid coolant, the AirCool3 offers unmatched reliability and unbeatably low cost of ownership.
Thermal Wafer Chuck systems are strategic equipment elements in semiconductor production. They enable manufacturers to perform electrical tests on the wafer before the ICs are separated and packaged. Devices that would fail later in the process can be removed before the devices undergo the expensive process of packaging thereby saving considerable manufacturing costs.
The AirCool3 System features a wide temperature range for thorough chip testing at temperatures as low as -65°C or as high as +300°C. Since the system makes use of readily available pressurized air as coolant, it does not require costly and unreliable liquid cooling units. An ERS air-only system is able to actively dissipate heat from the test needles throughout the entire temperature range of the chuck - including the zone between +50°C and +90°C that is so challenging for liquid cooling systems. With its modular concept, the AirCool3 offers an extensive upgrade path. Depending on the chilling module, it offers a minimum temperature between +35°C and -65°C. The flexible algorithms in the AirCool3 electronic control unit enable users to meet all test applications from low noise to high power dissipation.
Due to the utilization of clean air instead of liquid coolants, the system consumes less power than comparable systems, requires much less maintenance and does away with the expensive and unreliable liquids used in conventional systems. From the perspective of the user, ERS"s patented air-only cooling method translates into very low footprint and a very high reliability - two important factors in the cost calculation of a semiconductor manufacturing plant. Compared to competing systems, the AirCool3 reduces the cost of ownership by up to 50 percent for a 300mm platform or up to 25 percent for a 200mm platform.
For further information visit: www.ers-gmbh.de
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ERS electronic GmbH, located near Munich, is in its 40th year of supplying the most innovative thermal test solutions to the semiconductor industry. The most famous products are its fast-ramping and precise low-noise thermal chuck systems (-65°C to +500°C) for analytical, parametric and wafer sort probing up to 300mm.ERS also designs and builds stand-alone thermal-forcing systems and custom production tools for special applications. ERS invented the AirCool, AirCoolplus and PowerSense thermal chuck systems that have been fully integrated into all major manual, semi- and full automatic wafer probers.
Brand+Image
Timothy K. Göbel
Kaagangerstr. 36
82279 Eching a.A.
ers(at)brandandimage.de
+49 8143 9926834
http://www.brandandimage.de
Datum: 25.08.2011 - 12:31 Uhr
Sprache: Deutsch
News-ID 59138
Anzahl Zeichen: 2354
contact information:
Contact person: Klemens Reitinger
Town:
Germering
Phone: +49-89-8941320
Kategorie:
Hazadous Materials Management
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"ERS AirCool3 Chuck System boosts reliability, cuts operating costs"
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