Semiconductor Memory IP Market Global Trends, Size, Segments, Competitors Strategy, Regional Analysis, Review, Key Players Profile, Statistics and Growth to 2023
(firmenpresse) - Market Highlights
The latest report published by Market Research Future (MRFR) states that the global semiconductor memory IP market industry is valued over USD 580 Mn and is estimated to thrive at a CAGR of 13.50% during the forecast period from 2018-2023. The key players are expected to find considerable opportunities in APAC and North America in the coming years. APAC happens to be the most productive market for semiconductor memory IP. The increasing customers of equipment like tablets, smartphones, and laptops have heightened the requirement for the semiconductor memory IP market industry. The introduction of the high-end mobile application is fueling the development of semiconductor memory IP industry growth.
Various factors are driving the growth of the semiconductor memory IP market. These factors, in accordance with the Market Research Future (MRFR) report, include increasing userbase of computing devices including laptops, smartphone, and tablet, rising penetration of the internet, increasing growth of the semiconductor industry, and burgeoning demand for high-performance memory systems across various end-user verticals. Additional factors propelling market growth include higher investments in semiconductor research and development activities, availability of the high-end mobile application, and growing demand for efficient household equipment as well as smart power saving equipment.
Segmentation:
The Market Research Future report offers a wide segmental analysis of the semiconductor memory IP market share based on type and application.
Based on type, the semiconductor memory IP market is segmented into SRAM (static random-access memory), NAND (negative AND), and DRAM (dynamic random-access memory). Of these, the DRAM segment will have the largest share in the market over the forecast period. DRAM finds numerous applications in next-generation data centers, enterprise servers, advanced graphics and network systems, high-performance computing, artificial intelligence, personal computers, and others.
Based on application, the semiconductor memory IP market is segmented into mobile computing devices, consumer electronic devices, automotive, industrial automation, networking, and others. Of these, the consumer electronics devices segment will dominate the market over the forecast period. It is predicted to grow at a 12.47% CAGR. Semiconductor memory IP is used in a wide array of consumer electronic devices such as digital imaging devices, digital TVs, devices, home networking/home automation, gaming consoles, AR/VR headsets, and others. This will be followed by the mobile computing devices segment that is predicted to touch USD 150.73 million.
Regional Analysis
The major areas covered in the report are North America, Asia Pacific, Latin America, Middle East, and Africa (MEA). APAC region holds the apex position in the context of revenue. The market in APAC commands the valuation accounting more than USD 240 million and is estimated to expand at a CAGR of 14.79% from 2018-2023. Countries like Taiwan, China, and South Korea have now become the primary focal point of manufacturing for a wide range of electronic equipment, including the semiconductor memory IPs. Moreover, government policies are favorable, and the existence of key companies in the region plays a significant role and has a great influence on the market.
Meanwhile, North America stands at the second position. The North American market is likely to grow at a CAGR of 13.37%. The taxes and hikes imposed may have a catapult effect on domestic manufacturing.
Key Players
Key players profiled in the semiconductor memory IP market report include Siemens Business and Dolphin Integration, Mentor, SK Hynix Inc., Cadence Design Systems, Inc., Samsung Electronics Co., Ltd., Arm Limited, Micron Technology Inc., eSilicon Corporation, Synopsys, Inc., and Rambus Inc., among others.
June 2019: eMemory has announced that its one-time programmable non-volatile memory IP, NeoFuse has been qualified on Winbond 25nm DRAM process technology which is ready for production. NeoFuse is compatible with the present DRAM process. This can be utilized for DRAM repair both in chip probing tests as well as final tests to attain multi-time repairs, thereby reducing the price of laser trimming as well as repair setup time along with facilitating manufacturing flow.
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