Palomar Technologies Announces Exhibit at Productronica 2011 and Highlights Large Work Area Hi-Rel Wire Bonder and Die Attach Systems
(firmenpresse) - CARLSBAD, CA -- (Marketwire) -- 11/08/11 -- , the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that it will exhibit in Hall B2, Booth 315 at Productronica 2011, held in Munich, Germany on November 15-18.
"Palomar Technologies has a as an industry expert in design, engineering, automation and metrology for even the most complex component placement and wire bonding applications," said , managing director of Palomar Technologies GmbH. "Our and represent the latest advances in wire and die bonding technology, incorporating leading-edge mechanical design, control architecture and user-friendly GUI to provide the highest net throughput and flexibility of any comparable tool on the market today."
The with capabilities including deep access wire bonding of 11.10 to 19.05mm, automated in-line and magazine handlers, tailless bump mode and improved reliability with stand-off stitch wires. With cycle times up to 0.125 sec/wire and 0.077 sec/bump, and a placement accuracy of +/- 2.5 micron, 3 sigma, the overall precision of the results in high-yield processing of fine-pitch high wire count applications and is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.
The -- the fully automated and ultra-flexible component placement system capable of a placement accuracy of +/- 7 microns and repeatability of 3.5 micron at 3 sigma -- was recently awarded the 2011 New Product Introduction Award for its efficiency and versatility to perform such processes as . Current owners of 3500-III Die Bonders have the opportunity to trade in their system for substantial credit towards the 3800 Die Bonder through Palomar Technologies' .
Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of automated high-accuracy, large work area die attach and wire bond equipment and precision contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to meet their needs for optoelectronic packaging, complex hybrid assembly and micron-level component attachment. For more information, visit .
Josef Schmidl
Managing Director
Palomar Technologies GmbH
49-9131-48009-30
Jessica Sylvester
Marketing Communications
Palomar Technologies
760-931-3681
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Datum: 08.11.2011 - 14:00 Uhr
Sprache: Deutsch
News-ID 85151
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