ST-Ericsson achieves HSPA+ breakthrough
(Thomson Reuters ONE) -
New M5730 two-chip modem consumes half the power of existing HSPA+ 21Mbps
solutions
Geneva, Switzerland, October 6, 2010 - ST-Ericsson, a world leader in wireless
platforms and semiconductors, is launching an extremely power-efficient and
compact HSPA+ modem capable of transmitting data at speeds of up to 21Mbps. With
up to fifty per cent lower power consumption than competing HSPA+ 21Mbps modems
available on the market, the highly-integrated M5730 will enable ST-Ericsson's
customers to produce small, affordable and power-efficient HSPA+ smartphones,
USB-dongles and embedded modules.
Mobile devices equipped with the M5730 modem, which is already being sampled by
customers, will be able to offer up to double the high-speed Internet browsing
time of mobile devices using other HSPA+ 21Mbps modems.
"We have made a breakthrough in HSPA+ modem engineering that is enabling our
customers to produce sleek devices offering both high transmission speeds and
long battery lives," said Magnus Hansson, Senior Vice President and head of LTE
and 3G Modem Solutions division at ST-Ericsson. "We anticipate seeing
smartphones and other connected devices based on our new HSPA+ modem shipping in
early 2011, enabling consumers and business people to spend more time surfing
the Internet at high-speeds and less time worrying about power adaptors and
sockets."
ST-Ericsson's M5730 is the world's first two-chip 21Mbps modem and the smallest
HSPA+ 21Mbps solution to date. Using just two chips makes the M5730 very
compact, reducing the bill of materials for device manufacturers. It also has
exceptionally low-levels of heat dissipation enabling it to be embedded in a
very wide range of devices.
The M5730 makes use of the 64-QAM advanced modulation technique, providing end-
users with higher average throughput speeds and enabling mobile operators to
make more efficient use of their spectrum. ST-Ericsson's field tests with mobile
operators found the use of 64-QAM technology results in an average 30 percent
increase in spectral efficiency.
Notes to Editors
On Sept 22, the Global mobile Suppliers Association (the GSA) reported that 73
HSPA+ networks are currently up and running and 127 operators in 59 countries
have committed to HSPA+ network deployments.
ST-Ericsson's customers will be able to quickly roll out devices based on the
M5730 as it uses the same modem protocol software as the M570 HSPA+ 21Mbps
platform which has passed several major American, Asian and European mobile
operator IOT tests.
Read more about M5730
Photo of Magnus Hansson
Photo of M5730
About ST-Ericsson
ST-Ericsson is a world leader in developing and delivering a complete portfolio
of innovative mobile platforms and cutting-edge wireless semiconductor solutions
across the broad spectrum of mobile technologies. The company is a leading
supplier to the top handset manufacturers and ST-Ericsson's products and
technologies enable more than half of all phones in use today. The company
generated pro-forma sales of about USD 2.7 billion in 2009. ST-Ericsson was
established as a 50/50 joint venture by STMicroelectronics and Ericsson in
February 2009, with headquarters in Geneva, Switzerland. More information on
ST-Ericsson is available atwww.stericsson.com.
FOR FURTHER INFORMATION, PLEASE CONTACT:
Media Relations
Phone: +41 22 930 2733
Email:media.relations(at)stericsson.com
Investor Relations
Phone: +41 22 929 6973
Email:investor.relations(at)stericsson.com
Please find translations in simplified and traditional Chinese attached.
[HUG#1449421]
Simplified Chinese:
http://hugin.info/141758/R/1449421/391374.pdf
ST-Ericsson achieves HSPA+ breakthrough:
http://hugin.info/141758/R/1449421/391373.pdf
Traditional Chinese:
http://hugin.info/141758/R/1449421/391375.pdf
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Source: ST-Ericsson via Thomson Reuters ONE
Unternehmensinformation / Kurzprofil:
Datum: 06.10.2010 - 10:30 Uhr
Sprache: Deutsch
News-ID 44340
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